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TurboX C8750 Development Kit
Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.

KEY FEATURES:

  • 8th Gen AI Engine: Over 10x performance boost to previous gen
  • Next Gen Oryon™ CPU:up to 1.5x over previous gen
  • 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
  • Hypervisor enables multiple trusted VMs (TVMs)
  • 3 times GPU performance improvement compared to the previous generation
  • 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
Chipset
Type Development Kits
SP895BD-AP smart module
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm Techolongies’ IoT chipset CQ8750-S, with built-in incredible octa-core high-performance Qualcomm Oryon™ CPU, Qualcomm® Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Qualcomm® Hexagon™ DSP, and Qualcomm Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.

KEY FEATURES:

  • Android 15/Linux smart module
  • LGA package
  • 33.0mm x 39.0mm x 3.85mm
  • Operating temperature range of -30°C to +75°C
  • Qualcomm Oryon CPU
  • Adreno 830 GPU
  • Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
  • Qualcomm Spectra ISP
  • Adreno 8550 VPU
  • Adreno DPU
  • Neural processing unit
  • Security processing
  • Video encoder: 4K @ 120fps; 8K @ 30fps
  • Video decoder: 4K @ 240fps; 8K @ 60fps
  • Computing power of up to 80 TOPS
Chipset
Type System-on-Modules