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QRB-5165N-0-FCBGA1075+HS-MT-00-0-AA
QRB5165N (000-0-AA), FCBGA1075+HS, BASE AP WITH CPU_POR, IOT NON-POP, LPDDR4, KONA (2.1), TSMC
QRB5165N (000-0-AA), FCBGA1075+HS, BASE AP WITH CPU_POR, IOT NON-POP, LPDDR4, KONA (2.1), TSMC
ByQualcomm
Chipset
QRB-5165-0-MPSP1099-TR-02-0-AA
QRB5165 (002-0-AA), MPSP1099, BASE AP WITH CPU_POR, LPDDR5, IOT, KONA (2.1), TSMC
QRB5165 (002-0-AA), MPSP1099, BASE AP WITH CPU_POR, LPDDR5, IOT, KONA (2.1), TSMC
ByQualcomm
Chipset
QRB-5165-0-MPSP1099-MT-02-0-AA
QRB5165 (002-0-AA), MPSP1099, BASE AP WITH CPU_POR, LPDDR5, IOT, KONA (2.1), TSMC
QRB5165 (002-0-AA), MPSP1099, BASE AP WITH CPU_POR, LPDDR5, IOT, KONA (2.1), TSMC
ByQualcomm
Chipset
QRB-5165N-3-FCBGA1075+HS-MT-00-0-AA
QRB5165N (300-0-AA), FCBGA1075+HS, BASE AP WITH CPU_POR, IOT NON-POP, INDUSTRIAL TEMP, LPDDR5, KONA (2.1), TSMC
QRB5165N (300-0-AA), FCBGA1075+HS, BASE AP WITH CPU_POR, IOT NON-POP, INDUSTRIAL TEMP, LPDDR5, KONA (2.1), TSMC
ByQualcomm
Chipset
QRB-5165N-2-FCBGA1075+HS-MT-00-0-AA
QRB5165N (200-0-AA), FCBGA1075+HS, BASE AP WITH CPU_POR, IOT NON-POP, LPDDR5, KONA (2.1), TSMC
QRB5165N (200-0-AA), FCBGA1075+HS, BASE AP WITH CPU_POR, IOT NON-POP, LPDDR5, KONA (2.1), TSMC
ByQualcomm
Chipset
Open-Q™ 5165RB SOM
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
Chipset
Open-Q™ 865 Development Kit
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
Chipset
VVDN-QRB5165 Development Kit
VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.
KEY FEATURES:
- Based on powerful Qualcomm® QRB5165 SoC
- Advanced imaging capability
- Ultra-compact form factor
VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.
KEY FEATURES:
- Based on powerful Qualcomm® QRB5165 SoC
- Advanced imaging capability
- Ultra-compact form factor
AirPath
Based on the Qualcomm® QRB5165 SoC, 5G communication module, extension I/F supporting AI accelerator chipset, multiple GPIO ports and Ethercat for multi-camera and vision sensors, this platform boasts advanced specifications and high-performance mobility that provide the compatibility and scalability required for implementing intelligent robots.
KEY FEATURES:
- 1) Key Robotic Solutions2) 5G Connectivity3) Edge AI & Cloud Combination4) Open Development Environment
Based on the Qualcomm® QRB5165 SoC, 5G communication module, extension I/F supporting AI accelerator chipset, multiple GPIO ports and Ethercat for multi-camera and vision sensors, this platform boasts advanced specifications and high-performance mobility that provide the compatibility and scalability required for implementing intelligent robots.
KEY FEATURES:
- 1) Key Robotic Solutions2) 5G Connectivity3) Edge AI & Cloud Combination4) Open Development Environment
Chipset
QRB5165N,QRB5165M
LEC-RB5N
The ADLINK LEC-RB5N is a SMARC module powered by the Qualcomm® QRB5165 SoC and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device AI capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, defense, industrial and logistics sectors.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU, Hexagon HTA up to 15 TOPS
- 4K HDMI/MIPI DSI display, MIPI CSI cameras
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
The ADLINK LEC-RB5N is a SMARC module powered by the Qualcomm® QRB5165 SoC and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device AI capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, defense, industrial and logistics sectors.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU, Hexagon HTA up to 15 TOPS
- 4K HDMI/MIPI DSI display, MIPI CSI cameras
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
Chipset
