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KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- Power autonomy through positioning in the cloud; integrated u-blox M10 GNSS receiver and CloudLocate
- Guaranteed best coverage with 23 dBm output power
- Simultaneous LTE communication with GNSS positioning
KEY FEATURES:
- Power autonomy through positioning in the cloud; integrated u-blox M10 GNSS receiver and CloudLocate
- Guaranteed best coverage with 23 dBm output power
- Simultaneous LTE communication with GNSS positioning
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- Guaranteed best coverage with 23 dBm output power
- Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex
- Always and everywhere location, with u-blox CellLocate®
KEY FEATURES:
- Guaranteed best coverage with 23 dBm output power
- Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex
- Always and everywhere location, with u-blox CellLocate®
KEY FEATURES:
- Cat NB2/NB1 Module with optional eSIM and Integrated GNSS
- FOTA Capable, Power Saving Modes,
- Cavli Hubble Connectivity
- Form factors : LGA
- Ultra-Low Power Consumption
KEY FEATURES:
- Cat NB2/NB1 Module with optional eSIM and Integrated GNSS
- FOTA Capable, Power Saving Modes,
- Cavli Hubble Connectivity
- Form factors : LGA
- Ultra-Low Power Consumption
KEY FEATURES:
- LTE M1/NB2/2G Module with optional eSIM and In-built GNSS
- Independent GNSS, DFOTA Capable, Power Saving Modes, Cavli Hubble Connectivity
- Versatile Form factors : LGA
KEY FEATURES:
- LTE M1/NB2/2G Module with optional eSIM and In-built GNSS
- Independent GNSS, DFOTA Capable, Power Saving Modes, Cavli Hubble Connectivity
- Versatile Form factors : LGA
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
KEY FEATURES:
- Five two-way screw terminals and one three-way screw terminal
- One 2-pin “Shrouded Header” and thirteen 3-pin headers
- One 1-pin header
- Provision for five resistors
- Configuration by 0 Ohm resistors
KEY FEATURES:
- Five two-way screw terminals and one three-way screw terminal
- One 2-pin “Shrouded Header” and thirteen 3-pin headers
- One 1-pin header
- Provision for five resistors
- Configuration by 0 Ohm resistors
KEY FEATURES:
- Drop-in, embeddable, data storage and transport module for cellular IoT products, bi-directionally pumping JSON or binary data between device and your cloud
- Removable, field-upgradable 30x35mm system-on-a-module (SOM)
- Cellular device without monthly fees
KEY FEATURES:
- Drop-in, embeddable, data storage and transport module for cellular IoT products, bi-directionally pumping JSON or binary data between device and your cloud
- Removable, field-upgradable 30x35mm system-on-a-module (SOM)
- Cellular device without monthly fees
KEY FEATURES:
- Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- SIM7070G provides deeper coverage enhancement compared to GSM
- Form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
KEY FEATURES:
- Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- SIM7070G provides deeper coverage enhancement compared to GSM
- Form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070E provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070E is compatible with SIM7000X/SIM800F/SIM900
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070E provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070E is compatible with SIM7000X/SIM800F/SIM900
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7080 series provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of SIM7080 is compatible with SIM7020/SIM868
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7080 series provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of SIM7080 is compatible with SIM7020/SIM868
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070G provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070G provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
KEY FEATURES:
- Designed for low-power, wide-area, massive IoT connection
- Supports multiple protocols including CoAP, TCP/UDP, MQTT, OMA-LWM2M, DTLS and CM oneNET
- GM100 can support PSM and eDRX low-power working mode
KEY FEATURES:
- Designed for low-power, wide-area, massive IoT connection
- Supports multiple protocols including CoAP, TCP/UDP, MQTT, OMA-LWM2M, DTLS and CM oneNET
- GM100 can support PSM and eDRX low-power working mode
KEY FEATURES:
- Low power camera as sensor
- Pre-trained AI detection
- LTE Cat-M1 & Wi-Fi option available
KEY FEATURES:
- Low power camera as sensor
- Pre-trained AI detection
- LTE Cat-M1 & Wi-Fi option available
KEY FEATURES:
- Multi-mode LTE Cat-M1 / NB2
- Secure enrollment on major cloud platforms, efficient remote updates and device management
- Premier security featuring secure boot, eSIM and a secure keystore
KEY FEATURES:
- Multi-mode LTE Cat-M1 / NB2
- Secure enrollment on major cloud platforms, efficient remote updates and device management
- Premier security featuring secure boot, eSIM and a secure keystore
KEY FEATURES:
- Design once and deploy globally with the xL865 form factor family
- Ideal for smart metering, security & surveillance, POS, health monitoring, fleet management & asset tracking
- LTE UE Cat M1/NB2 compliant to the latest 3 GPP Rel. 14 eMTC
KEY FEATURES:
- Design once and deploy globally with the xL865 form factor family
- Ideal for smart metering, security & surveillance, POS, health monitoring, fleet management & asset tracking
- LTE UE Cat M1/NB2 compliant to the latest 3 GPP Rel. 14 eMTC
KEY FEATURES:
- 3GPP Rel.14 Cat.M1, Cat.NB1, Cat.NB2
- Global LPWA from a single package
- Supports 450 MHz bands
KEY FEATURES:
- 3GPP Rel.14 Cat.M1, Cat.NB1, Cat.NB2
- Global LPWA from a single package
- Supports 450 MHz bands
KEY FEATURES:
- LTE-M NB-IoT 2G
- Incremental FOTA Updates
- Embedded Processing
KEY FEATURES:
- LTE-M NB-IoT 2G
- Incremental FOTA Updates
- Embedded Processing
KEY FEATURES:
- 3GPP Rel.14 Cat.NB1, Cat.NB2, and 2G
- Global LPWA from a single package
KEY FEATURES:
- 3GPP Rel.14 Cat.NB1, Cat.NB2, and 2G
- Global LPWA from a single package
KEY FEATURES:
- LTE-M NB-IoT 2G
- Incremental FOTA Updates
- Embedded Processing
KEY FEATURES:
- LTE-M NB-IoT 2G
- Incremental FOTA Updates
- Embedded Processing
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU; Qualcomm Spectra™ 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU; Qualcomm Spectra™ 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1x1 802.11a/b/g/n/ac and BT 5.1
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1x1 802.11a/b/g/n/ac and BT 5.1
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1
- Pin and software compatible with Qualcomm® QCS410 processor
- Supports Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1
- Pin and software compatible with Qualcomm® QCS410 processor
- Supports Linux
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
TurboX C4210 SOM (System On Module) is designed based on the Qualcomm® QRB4210 platform. It brings high-value features to mid-tier devices, designed to support advanced graphics, triple ISPs for advanced dual-camera experience, dedicated compute DSP for computer vision and video post-processing, etc. The form factor of the module is 34mm×35mm×2.9mm LGA package which can be fit into devices including robotics, dash camera, video conference, smart retail, etc. TurboX C4210 SOM is an ideal platform for both industrial and consumer applications requiring high data rates multimedia function and can help to rapidly develop cost-effective cellular devices to the market.
KEY FEATURES:
- Qualcomm(R) Hexagon(TM) 683 DSP with dual-HVX512 for AI computing
- Support up to 3 cameras
TurboX C4210 SOM (System On Module) is designed based on the Qualcomm® QRB4210 platform. It brings high-value features to mid-tier devices, designed to support advanced graphics, triple ISPs for advanced dual-camera experience, dedicated compute DSP for computer vision and video post-processing, etc. The form factor of the module is 34mm×35mm×2.9mm LGA package which can be fit into devices including robotics, dash camera, video conference, smart retail, etc. TurboX C4210 SOM is an ideal platform for both industrial and consumer applications requiring high data rates multimedia function and can help to rapidly develop cost-effective cellular devices to the market.
KEY FEATURES:
- Qualcomm(R) Hexagon(TM) 683 DSP with dual-HVX512 for AI computing
- Support up to 3 cameras
Dream up and deploy a new generation of everyday robotics and IoT products for the masses without sacrificing features or performance.
The Qualcomm Robotics RB2 platform integrates high-level features, AI solutions, and powerful performance in a unified, cost-effective solution giving OEMs, ODMs, and developers flexibility to design and create a generation of high-performance everyday robotics and IoT products.
The Qualcomm Robotics RB2 combines heterogeneous-compute performance and dedicated AI accelerator, communications technologies, and new levels of cost-effectiveness and accessibility for the industry. The platform is optimized for smaller devices and lower power consumption.
This extends to their built-in support for machine vision; support for up to three cameras, providing onboard intelligence to meld this data with other high-fidelity sensors from TDK for applications such as autonomous navigation.
KEY FEATURES:
- Designed with CPU architectures for increased speeds and sustained performance
- Dual-channel non-PoP high-speed memory
Dream up and deploy a new generation of everyday robotics and IoT products for the masses without sacrificing features or performance.
The Qualcomm Robotics RB2 platform integrates high-level features, AI solutions, and powerful performance in a unified, cost-effective solution giving OEMs, ODMs, and developers flexibility to design and create a generation of high-performance everyday robotics and IoT products.
The Qualcomm Robotics RB2 combines heterogeneous-compute performance and dedicated AI accelerator, communications technologies, and new levels of cost-effectiveness and accessibility for the industry. The platform is optimized for smaller devices and lower power consumption.
This extends to their built-in support for machine vision; support for up to three cameras, providing onboard intelligence to meld this data with other high-fidelity sensors from TDK for applications such as autonomous navigation.
KEY FEATURES:
- Designed with CPU architectures for increased speeds and sustained performance
- Dual-channel non-PoP high-speed memory
KEY FEATURES:
- Ultra low power: Always-on intelligent vision @ < 1mW average end-to-end power
- Low cost: Low single digits for HW & CV algorithms
- Privacy: Images are not stored or emitted - send only data output
KEY FEATURES:
- Ultra low power: Always-on intelligent vision @ < 1mW average end-to-end power
- Low cost: Low single digits for HW & CV algorithms
- Privacy: Images are not stored or emitted - send only data output
The TurboX T95 SOM (System On Module) is based on new Qualcomm® MDM9205 modem and purpose-built for the low power wide area Internet of Things applications. It integrates all key innovations required to build cellular-enabled IoT products and services into a single module, including 3GPP Rel. 14 compliant LTE Cat M1/Cat NB2, E-GPRS connectivity, integrated GNSS, hardware-based security, capable of cloud services, and rich set of development tools.
KEY FEATURES:
- Cat M1 & Cat NB2 & EGPRS
- AT Command
- GPS, GLONASS, Beidou, Galileo, QZSS
- 3uA in PSM mode
- >23 bands worldwide
- Wi-Fi Position
- LWM2M, CoAP, MQTT, FTP, TLS
- OTA
The TurboX T95 SOM (System On Module) is based on new Qualcomm® MDM9205 modem and purpose-built for the low power wide area Internet of Things applications. It integrates all key innovations required to build cellular-enabled IoT products and services into a single module, including 3GPP Rel. 14 compliant LTE Cat M1/Cat NB2, E-GPRS connectivity, integrated GNSS, hardware-based security, capable of cloud services, and rich set of development tools.
KEY FEATURES:
- Cat M1 & Cat NB2 & EGPRS
- AT Command
- GPS, GLONASS, Beidou, Galileo, QZSS
- 3uA in PSM mode
- >23 bands worldwide
- Wi-Fi Position
- LWM2M, CoAP, MQTT, FTP, TLS
- OTA
KEY FEATURES:
- Qualcomm® Hexagon 683 DSP with dual-HVX512
- BLE 5.1 compliant
- Support up to 3 cameras
- 1080P@60FPS video record and play
- Wi-Fi 802.11a/b/n/ac LTE support
- Qualcomm® Kryo™ 260 CPU:4 x A73@ 2.0GHz + 4 x A53@1.8GHz
KEY FEATURES:
- Qualcomm® Hexagon 683 DSP with dual-HVX512
- BLE 5.1 compliant
- Support up to 3 cameras
- 1080P@60FPS video record and play
- Wi-Fi 802.11a/b/n/ac LTE support
- Qualcomm® Kryo™ 260 CPU:4 x A73@ 2.0GHz + 4 x A53@1.8GHz
KEY FEATURES:
- LTE Cat M1/Cat NB2/EGPRS module with ultra-low power consumption
- Support VoLTE for LTE Cat M1 and CS voice for GSM
- Cost-effective SMT form factor of 18.7 mm × 16.0 mm × 2.1 mm
KEY FEATURES:
- LTE Cat M1/Cat NB2/EGPRS module with ultra-low power consumption
- Support VoLTE for LTE Cat M1 and CS voice for GSM
- Cost-effective SMT form factor of 18.7 mm × 16.0 mm × 2.1 mm
KEY FEATURES:
- Multi-band LTE Cat M1/Cat NB2/EGPRS module with global coverage
- Multi-constellation GNSS receiver
KEY FEATURES:
- Multi-band LTE Cat M1/Cat NB2/EGPRS module with global coverage
- Multi-constellation GNSS receiver
KEY FEATURES:
- Supports Cat M1/NB-IoT/GPRS three-mode
- Supports worldwide bands and long usage lifetimes
- Enables the next generation of smart terminal and IoT products & solutions
KEY FEATURES:
- Supports Cat M1/NB-IoT/GPRS three-mode
- Supports worldwide bands and long usage lifetimes
- Enables the next generation of smart terminal and IoT products & solutions
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
KEY FEATURES:
- Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
KEY FEATURES:
- Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
KEY FEATURES:
- Powered by micro-sized (50x25mm) Open-Q 610 µSOM
- Open-frame Mini-ITX form-factor carrier board for evaluation and development
- Numerous I/O and connectivity options
- USB Type-C, USB Type-A, Gb Ethernet
KEY FEATURES:
- Powered by micro-sized (50x25mm) Open-Q 610 µSOM
- Open-frame Mini-ITX form-factor carrier board for evaluation and development
- Numerous I/O and connectivity options
- USB Type-C, USB Type-A, Gb Ethernet
