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Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
Chipset
ME910G1
This module includes Qualcomm® 9205 LTE modem. Global bands support for worldwide deployments; part of the Telit’s flagship xE910 family that includes 2G, 3G, 4G modules in the same form factor. • Multimode LTE Cat-M1 / NB2 / EGPRS • Size: 28.2mm x 28.2mm x 2.2mm
This module includes Qualcomm® 9205 LTE modem. Global bands support for worldwide deployments; part of the Telit’s flagship xE910 family that includes 2G, 3G, 4G modules in the same form factor. • Multimode LTE Cat-M1 / NB2 / EGPRS • Size: 28.2mm x 28.2mm x 2.2mm
Chipset
ME310G1-W1
This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2
This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2
Chipset
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
Open-Q™ 610 μSOM
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
Chipset
Open-Q™ 4210 System in Package
The Open-Q™ 4210 Series SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QRB4210 (Yocto Linux) processors utilize Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4200 SIP creates the perfect computing core for a variety of edge AI video analytic applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
The Open-Q™ 4210 Series SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QRB4210 (Yocto Linux) processors utilize Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4200 SIP creates the perfect computing core for a variety of edge AI video analytic applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
Chipset
Open Q RB Development Kit
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs based on the Qualcomm® QRB4210 and Qualcomm® QRB2210 (Yocto Linux) processors. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs based on the Qualcomm® QRB4210 and Qualcomm® QRB2210 (Yocto Linux) processors. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
VVDN QCS 410 SOM
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
VVDN QCS 610 SOM
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
Development Kit based on QCS610
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
EVK10300 - Solar Energy Harvesting Evaluation Board
Power Management IC Development Tools: Energy Harvesting Evaluation Board (AEM10300- Photovoltaic).
KEY FEATURES:
- Five two-way screw terminals and one three-way screw terminal
- One 2-pin “Shrouded Header” and thirteen 3-pin headers
- One 1-pin header
- Provision for five resistors
- Configuration by 0 Ohm resistors
Power Management IC Development Tools: Energy Harvesting Evaluation Board (AEM10300- Photovoltaic).
KEY FEATURES:
- Five two-way screw terminals and one three-way screw terminal
- One 2-pin “Shrouded Header” and thirteen 3-pin headers
- One 1-pin header
- Provision for five resistors
- Configuration by 0 Ohm resistors
Chipset
Notecard
As an embeddable device-to-cloud data pump, the Notecard eliminates all complexity and friction that exists with existing IoT solutions. It enables development and rapid iteration of production-quality secure cellular IoT solutions at an extremely low, fixed cost. With as little as two lines of code on the controlling MCU, and with no external libraries or dependencies, data can be sent from device to cloud.
KEY FEATURES:
- Drop-in, embeddable, data storage and transport module for cellular IoT products, bi-directionally pumping JSON or binary data between device and your cloud
- Removable, field-upgradable 30x35mm system-on-a-module (SOM)
- Cellular device without monthly fees
As an embeddable device-to-cloud data pump, the Notecard eliminates all complexity and friction that exists with existing IoT solutions. It enables development and rapid iteration of production-quality secure cellular IoT solutions at an extremely low, fixed cost. With as little as two lines of code on the controlling MCU, and with no external libraries or dependencies, data can be sent from device to cloud.
KEY FEATURES:
- Drop-in, embeddable, data storage and transport module for cellular IoT products, bi-directionally pumping JSON or binary data between device and your cloud
- Removable, field-upgradable 30x35mm system-on-a-module (SOM)
- Cellular device without monthly fees
SIM7090
Cat-M/Cat-NB, SIM7090 in LGA form factor and has a compact size of 14.8mm*12.8mm which makes it ideal for compact product design. SIM7090 has powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I2C etc. The SIM7090 is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for M2M applications.
KEY FEATURES:
- Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- SIM7070G provides deeper coverage enhancement compared to GSM
- Form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
Cat-M/Cat-NB, SIM7090 in LGA form factor and has a compact size of 14.8mm*12.8mm which makes it ideal for compact product design. SIM7090 has powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I2C etc. The SIM7090 is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for M2M applications.
KEY FEATURES:
- Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- SIM7070G provides deeper coverage enhancement compared to GSM
- Form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
SIM7080G
CAT-M&NB-IoT Module. The SIM7080G is a Multi-Band CAT-M and NB-IoT module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides flexibility and ease of integration for customer's application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions. It offers unique combination of performance, security and flexibility.
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7080 series provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of SIM7080 is compatible with SIM7020/SIM868
CAT-M&NB-IoT Module. The SIM7080G is a Multi-Band CAT-M and NB-IoT module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides flexibility and ease of integration for customer's application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions. It offers unique combination of performance, security and flexibility.
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7080 series provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of SIM7080 is compatible with SIM7020/SIM868
SIM7070E
CAT-M&NB-IoT & GSM Module. The SIM7070G is Multi-Band CAT-M, NB-IoT and GPRS module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides much flexibility and ease of integration for customer's application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions.
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070E provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070E is compatible with SIM7000X/SIM800F/SIM900
CAT-M&NB-IoT & GSM Module. The SIM7070G is Multi-Band CAT-M, NB-IoT and GPRS module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides much flexibility and ease of integration for customer's application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions.
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070E provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070E is compatible with SIM7000X/SIM800F/SIM900
SIM7070G
CAT-M&NB-IoT&GSM Module. The SIM7070G is a Multi-Band CAT-M, NB-IoT and GPRS module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C and more. The module provides flexibility and ease of integration for customers' application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions.
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070G provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
CAT-M&NB-IoT&GSM Module. The SIM7070G is a Multi-Band CAT-M, NB-IoT and GPRS module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C and more. The module provides flexibility and ease of integration for customers' application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions.
KEY FEATURES:
- With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
- The SIM7070G provides deeper coverage enhancement compared to GSM
- The form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
ROS610
The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
Chipset
NB-IOT Module N27
N27 is an NB-IoT/eMTC/EGPRS module specially designed for M2M and IoT applications. Adopting the 3GPP Rel. 14 LTE technology, it delivers 1119 Kbps downlink and 588 Kbps uplink data rates. N27 is based on Qualcomm® MDM9205 and supports the integrated GNSS which greatly simplifies product design, and provides quicker, more accurate and more reliable position fix.
N27 is an NB-IoT/eMTC/EGPRS module specially designed for M2M and IoT applications. Adopting the 3GPP Rel. 14 LTE technology, it delivers 1119 Kbps downlink and 588 Kbps uplink data rates. N27 is based on Qualcomm® MDM9205 and supports the integrated GNSS which greatly simplifies product design, and provides quicker, more accurate and more reliable position fix.
QCS610 Development board
Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector.
Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector.
Chipset
QCS610 SoM 4057
Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video.
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video.
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
Chipset
