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qSmartAI80_CUQ610 - Qualcomm AI vision kit with multi-camera support
qSmartAI80_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises of e-con's Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module, a SoM based on Qualcomm® QCS610 SoC, and a carrier board.This Qualcomm camera kit is suited for running image-based machine learning and deep learning models at the edge making it perfect for industrial and retail applications. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems also provides all the necessary customization services for this AI vision development kit including the camera, carrier board, BSP, software, and enclosure.

KEY FEATURES:

  • AI Vision Kit based on Qualcomm® QCS610/410 SoC *
  • 4K ultra low light camera based on Sony Starvis IMX415 sensor
  • Multi-camera support (Supports upto 3 cameras)
  • Qualcomm neural processing SDK for AI
Chipset
Type Development Kits
SARA-R4
The SARA-R4 is a Cat M/NB2 module with 2G fallback designed in the popular u-blox SARA form factor. SARA-R4 supports 3GPP Rel 14 and features the best coverage with 23 dBm LTE output power. SARA-R4 is available also in combo cellular + GNSS variant onboarding the u-blox M10 GNSS platform allowing best navigation performance concurrently with LTE operations.

KEY FEATURES:

  • Power autonomy through positioning in the cloud; integrated u-blox M10 GNSS receiver and CloudLocate
  • Guaranteed best coverage with 23 dBm output power
  • Simultaneous LTE communication with GNSS positioning
Chipset
Type System-on-Modules
qSmartAI20_CUQ610 - 2MP Qualcomm® Edge AI Vision Kit with multi-camera support
qSmartAI20_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises e-con's Sony IMX462 based Full HD MIPI CSI-2 camera module.This AI vision kit has a small form factor and can perform all image processing and analytics indigenously without the connectivity or power of the cloud. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems provides all the necessary customization services for this vision AI development kit including the camera, carrier board, and software.

KEY FEATURES:

  • AI Vision Kit based on Qualcomm® QCS610/410 SoC *
  • Full HD ultra low light camera based on Sony Starvis IMX462 sensor
  • Multi-camera support (Supports upto 3 cameras)
  • Qualcomm neural processing SDK for AI
Chipset
Type Development Kits
LEXI-R422
LEXI-R422 is the first module of the u-blox LEXI 16 x 16 mm compact form factor. It is based on the Qualcomm® 9205 LTE modem and offers LTE-M and NB-IoT coverage with 16 bands and software-based filtering configuration, plus 2G fallback to enable global deployments with a single product.

KEY FEATURES:

  •  Guaranteed best coverage with 23 dBm output power
  • Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex
  • Always and everywhere location, with u-blox CellLocate®
Chipset
Type System-on-Modules
C42QM
C42QM is a series of LTE Cat M1/ NB-IoT Module, designed for IoT and M2M applications, that support 3GPP release 10. The C42QM module features integrated GNSS, providing precise and reliable positioning through GPS, GLONASS, BEIDOU, and Galileo. It supports VoLTE and SMS over IMS/SG/CS, along with a wide range of Internet protocols and industry-standard interfaces.The module comes in two variants: C42QM-EA for the Europe and Asia market, and C42QM-NA for the North America market. Additionally, with an optional integrated eSIM powered by Cavli Hubble platform, it offers global connectivity, reducing time to market. The C42QM module is well-suited for IoT applications such as asset tracking, e-mobility, data loggers, fleet management, and environmental monitoring.

KEY FEATURES:

  • LTE M1/NB2/2G Module with optional eSIM and In-built GNSS
  • Independent GNSS, DFOTA Capable, Power Saving Modes, Cavli Hubble Connectivity
  • Versatile Form factors : LGA
Chipset
Type System-on-Modules
Development Kit based on QCS610
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.

KEY FEATURES:

  • Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
  • Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
  • Compact SOM size
Chipset
Type Development Kits
VVDN QCS 410 SOM
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.

KEY FEATURES:

  • High-performance IoT System-on-Chip (SoC)
  • Compact SOM size
  • Advanced ISP, machine learning, sensor processing, and voice control
Chipset
Type System-on-Modules
VVDN QCS 610 SOM
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.

KEY FEATURES:

  • Compact SOM Size
  • High-performance IoT System-on-Chip (SoC)
Chipset
Type System-on-Modules
EVK10300 - Solar Energy Harvesting Evaluation Board
Power Management IC Development Tools: Energy Harvesting Evaluation Board (AEM10300- Photovoltaic).

KEY FEATURES:

  • Five two-way screw terminals and one three-way screw terminal
  • One 2-pin “Shrouded Header” and thirteen 3-pin headers
  • One 1-pin header
  • Provision for five resistors
  • Configuration by 0 Ohm resistors
Chipset
Type Evaluation Boards
Notecard
As an embeddable device-to-cloud data pump, the Notecard eliminates all complexity and friction that exists with existing IoT solutions. It enables development and rapid iteration of production-quality secure cellular IoT solutions at an extremely low, fixed cost. With as little as two lines of code on the controlling MCU, and with no external libraries or dependencies, data can be sent from device to cloud.

KEY FEATURES:

  • Drop-in, embeddable, data storage and transport module for cellular IoT products, bi-directionally pumping JSON or binary data between device and your cloud
  • Removable, field-upgradable 30x35mm system-on-a-module (SOM)
  • Cellular device without monthly fees
Chipset
MDM9205,PME9205
Type System-on-Modules
SIM7090
Cat-M/Cat-NB, SIM7090 in LGA form factor and has a compact size of 14.8mm*12.8mm which makes it ideal for compact product design. SIM7090 has powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I2C etc. The SIM7090 is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for M2M applications.

KEY FEATURES:

  • Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
  • SIM7070G provides deeper coverage enhancement compared to GSM
  • Form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
Chipset
Type System-on-Modules
SIM7070E
CAT-M&NB-IoT & GSM Module. The SIM7070G is Multi-Band CAT-M, NB-IoT and GPRS module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides much flexibility and ease of integration for customer's application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions.

KEY FEATURES:

  • With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
  • The SIM7070E provides deeper coverage enhancement compared to GSM
  • The form factor and AT commands of the SIM7070E is compatible with SIM7000X/SIM800F/SIM900
Chipset
Type System-on-Modules
SIM7080G
CAT-M&NB-IoT Module. The SIM7080G is a Multi-Band CAT-M and NB-IoT module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides flexibility and ease of integration for customer's application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions. It offers unique combination of performance, security and flexibility.

KEY FEATURES:

  • With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
  • The SIM7080 series provides deeper coverage enhancement compared to GSM
  • The form factor and AT commands of SIM7080 is compatible with SIM7020/SIM868
Chipset
Type System-on-Modules
SIM7070G
CAT-M&NB-IoT&GSM Module. The SIM7070G is a Multi-Band CAT-M, NB-IoT and GPRS module solution in a SMT type. It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C and more. The module provides flexibility and ease of integration for customers' application. It is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions.

KEY FEATURES:

  • With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX)
  • The SIM7070G provides deeper coverage enhancement compared to GSM
  • The form factor and AT commands of the SIM7070G is compatible with SIM7000X/SIM800F/SIM900
Chipset
Type System-on-Modules
NB-IOT Module N27
N27 is an NB-IoT/eMTC/EGPRS module specially designed for M2M and IoT applications. Adopting the 3GPP Rel. 14 LTE technology, it delivers 1119 Kbps downlink and 588 Kbps uplink data rates. N27 is based on Qualcomm® MDM9205 and supports the integrated GNSS which greatly simplifies product design, and provides quicker, more accurate and more reliable position fix.
Chipset
Type System-on-Modules
ROS610
The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications.

KEY FEATURES:

  • . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
Chipset
Type Development Kits
QCS610 Development board
Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector.
Chipset
Type Development Kits
QCS610 SoM 4057
Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video.

KEY FEATURES:

  • Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
Chipset
Type System-on-Modules
IPC610 Open Development Kit based on Qualcomm® QCS610 platform
Powered by the Qualcomm® QCS610 processor (Qualcomm® Vision Intelligence Platform), the IPC610 ODK produced by Altek Corporation is the perfect reference design for the AIoT camera. Combining the Qualcomm® Artificial Intelligence Engine with Altek’s industry expertise in imaging products, this is a best-in-class product for your edge computing needs.
Chipset
Type Development Kits
GM100 - Cat-M/NB-IoT Module
Based on Qualcomm® MDM9205 modem, GM100 is an ultra small NB-IoT/Cat-M/GPRS module: 20mm × 24mm× 2.3mm. It is fully compatible with 3GPP R14 standard. GM100 can support VoLTE under Cat-M mode, that means it can support mobility and lower power consumption, and these three advantages make it a good choice for Smart meter, Smart city, wearable devices and tracker industries.

KEY FEATURES:

  • Designed for low-power, wide-area, massive IoT connection
  • Supports multiple protocols including CoAP, TCP/UDP, MQTT, OMA-LWM2M, DTLS and CM oneNET
  • GM100 can support PSM and eDRX low-power working mode
Chipset
Type System-on-Modules
AIoT Camera
AIoT Camera product supports LTE Cat-M1: B2/4/12/13/25/26 (WNC IMQ5 Module), Micro-SIM (3FF) and Wi-Fi Dual Band 802.11 b/g/n WLA. Single Sensor support FOV: Horizontal 72°; Vertical 54° . Resolution: 320*240 (max). Non-rechargeable AAA battery*2. Product Dimensions : 103(L) * 73(W) * 25(T) mm. Compliance of Device Level: PTCRB (LTE version)/FCC/IC.

KEY FEATURES:

  • Low power camera as sensor
  • Pre-trained AI detection
  • LTE Cat-M1 & Wi-Fi option available
Chipset
Type System-on-Modules
Cinterion EXS62
Gemalto's Cinterion EXS82-W Wireless IoT Module is driving LTE evolution to 5G enabling Low Power Wide Area (LPWA) connectivity for billions of new industrial applications. The innovative Cinterion platform leverages Qualcomm® MDM9205 modem and the mature LTE ecosystem to deliver global LTE-M and NB-IoT connectivity with 2G fallback to cover scenarios where LTE-M and/or NB-IoT are not yet available.

KEY FEATURES:

  • Multi-mode LTE Cat-M1 / NB2
  • Secure enrollment on major cloud platforms, efficient remote updates and device management
  • Premier security featuring secure boot, eSIM and a secure keystore
ByGEMALTO
Chipset
Type System-on-Modules
ML865G1-WW
The ML865G1 is the Cat M1/NB2 evolution in the widely deployed Telit xL865 product family. Specified in the Release 14 of the 3GPP standard, LTE Cat M1/NB2 is specially tailored for IoT applications, offering optimized power consumption and enhanced coverage.

KEY FEATURES:

  • Design once and deploy globally with the xL865 form factor family
  • Ideal for smart metering, security & surveillance, POS, health monitoring, fleet management & asset tracking
  • LTE UE Cat M1/NB2 compliant to the latest 3 GPP Rel. 14 eMTC
Chipset
Type System-on-Modules
ME910G1
This module includes Qualcomm® 9205 LTE modem. Global bands support for worldwide deployments; part of the Telit’s flagship xE910 family that includes 2G, 3G, 4G modules in the same form factor. • Multimode LTE Cat-M1 / NB2 / EGPRS • Size: 28.2mm x 28.2mm x 2.2mm
Chipset
Type System-on-Modules
ME310G1-W1
This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2
Chipset
Type System-on-Modules
TX62
The TX62 Wireless IoT Module accelerates the evolution of LTE to 5G by enabling LPWA connectivity for billions of new industrial applications via Cat. M and NB-IoT technologies. The TX62 IoT module introduces the new ‘Things’ footprint concept, especially developed for space-constrained applications which require a small size. With enhanced security and SIM, the platform is ideal for very small, battery-operated devices in remote locations, such as smart meters, asset trackers, healthcare apps, and wearables.

KEY FEATURES:

  • 3GPP Rel.14 Cat.M1, Cat.NB1, Cat.NB2
  • Global LPWA from a single package
  • Supports 450 MHz bands
Chipset
Type System-on-Modules
TX82
The TX82 Wireless IoT Module is driving LTE evolution to 5G by providing global LTE-M, NB-IoT, and 2G connectivity today while supporting 3GPP Rel. 14 and 5G for next-generation capabilities tomorrow.

KEY FEATURES:

  • 3GPP Rel.14 Cat.NB1, Cat.NB2, and 2G
  • Global LPWA from a single package
Chipset
Type System-on-Modules
EXS62
The EXS62-W Wireless IoT Module is driving LTE evolution to 5G enabling Low Power Wide Area (LPWA) connectivity for billions of new industrial applications.

KEY FEATURES:

  • LTE-M NB-IoT 2G
  • Incremental FOTA Updates
  • Embedded Processing
Chipset
Type System-on-Modules
EXS82
Telit Cinterion® EXS82-W Wireless IoT Module is driving LTE evolution to 5G, enabling Low Power Wide Area (LPWA) connectivity for billions of new industrial applications.

KEY FEATURES:

  • LTE-M NB-IoT 2G
  • Incremental FOTA Updates
  • Embedded Processing
Chipset
Type System-on-Modules
AIkri QCS610: Aikri-X10-6D-4
Aikri-X10-6D-4 development kit is based on the powerful Qualcomm® QCS610 octa-core processor. The kit comprises a SoM based on Qualcomm QCS610 and a carrier board. It comes with a pre-built Linux BSP that can help in early prototyping and parallel software development. It is an ideal platform for Enterprise Security Cameras, IP Cameras, Body Cam, Audio/Video Collaboration, Home/Industrial Automation, Tele-diagnostics, Smart Display, Videoconferencing & Industrial IoT solutions.

KEY FEATURES:

  • 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
  • Wi-Fi, Bluetooth, Ethernet
  • Pre-built Linux
Chipset
Type Development Kits
Camera Reference Designs
eInfochips has vast experience and in-depth expertise in designing and delivering camera solutions across a wide range of Qualcomm Technologies processors, to cater to applications such as Connected cameras, Video analytics, Security, and Surveillance. Our reference designs for smart camera solutions are ready-to-use, cost-effective, versatile, and an excellent choice for original equipment manufacturers (OEMs) to kick-start prototype development of their next-generation cameras. We also provide a software framework that allows you to configure your underlying camera sensors.Our reference designs include cameras with 360° field of view (FoV), multiple high-resolution concurrent streaming and capture capabilities, and stereoscopic vision. We provide enhanced support services.

KEY FEATURES:

  • Services to enable RAW, Bayer, or YUV sensors; ToF sensors
  • Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
  • HDR enabling and improvement; Camera sensor tuning
Type Reference Design Platforms
Aikri QRB4210 Display Kit: Aikri-42X-10LD-3-1
Aikri-42X-10LD-3-1, Aikri 4210 display development kit , comprises of Aikri 4210 SoM based on Qualcomm® QRB4210, a carrier board, and a mezzanine board. The Aikri 4210 display dev kit can also be completely powered from battery power. It is an ideal choice to kick-start the development of industrial handhelds, smart cameras, robotics, security panels, digital signage, and healthcare solutions.

KEY FEATURES:

  • Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU; Qualcomm Spectra™ 340T ISP
  • 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
  • OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
Chipset
Type Development Kits
Aikri QCS4290: Aikri-42X-90AD-4
Aikri-42X-90AD-4 development kit is based on Qualcomm® QCS4290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS4290 kit comprises Qualcomm® QCS4290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.  

KEY FEATURES:

  • Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
  • 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
  • OS: Android 12; Dimensions: 85mm x 54mm
Chipset
Type Development Kits
Aikri QRB4210: Aikri-42X-10LD-3
Aikri-42X-10LD-3 development kit is based on Qualcomm® QRB4210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB4210 kit comprises Qualcomm® QRB4210-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. 

KEY FEATURES:

  • Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
  • 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
  • OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
Chipset
Type Development Kits
Aikri QCS4290: Aikri-42X-90AS-4
Aikri-42X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS4290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS4290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:

  • Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
  • 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
  • OS: Android 12; Dimensions: 58 mm x 39 mm
Chipset
Type System-on-Modules
Aikri QRB4210: Aikri-42X-10LS-3
Aikri-42X-10LS-3 System-on-Module (SoM) is based on Qualcomm® QRB4210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB4210 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:

  • Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
  • 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1x1 802.11a/b/g/n/ac and BT 5.1
  • OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
Chipset
Type System-on-Modules
AIkri QCS610: Aikri-X10-6S-4
Aikri-X10-6S-4 System-on-Module is based on Qualcomm® QCS610 processor. Multi-core processing and advanced video codec offers high-resolution video capture at low power. The module offers tight system integration and optimization for superior performance and power efficiency. It enables multiple connectivity solutions with integrated Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0 solution. eInfochips also offers a development kit for benchmarking and PoC development.

KEY FEATURES:

  • 4GB LPDDR4x, 16GB eMMC 5.1
  • Pin and software compatible with Qualcomm® QCS410 processor
  • Supports Linux
Chipset
Type System-on-Modules
AIkri QCS410: Aikri-X10-4S
Aikri-X10-4S System-on-Module is based on the powerful Qualcomm® QCS410 processor. It offers multiple connectivity solutions with integrated Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0. The module enables tight system integration and optimization for superior performance and power efficiency. eInfochips also offers a development kit as part of the eInfochips' product line based on the QCS410 for benchmarking and PoC development.

KEY FEATURES:

  • Pin compatible and software compatible with Qualcomm® QCS610
  • 4GB LPDDR4x and 16GB eMMC 5.1
  • Supports Linux
Chipset
Type System-on-Modules
AIkri QCS410: Aikri-X10-4D
Aikri-X10-4D development kit is based on powerful Qualcomm® QCS410 quad-core processor. The kit comprises a SoM based on QCS410 and a carrier board. It comes with a pre-built Linux BSP that can help in early prototyping and parallel software development. It is an ideal platform for Enterprise Security Cameras, IP Cameras, Body Cam, Audio/Video Collaboration, Home/Industrial Automation, Tele-diagnostics, Smart Display, Videoconferencing & Industrial IoT solutions.

KEY FEATURES:

  • 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
  • Wi-Fi 802.11ac, BT 5.0, Ethernet/RGMII
  • Pre-built Linux
Chipset
Type Development Kits
Kiteboard 4290 SBC
Kiteboard 4290 is a Single Board Compute & Connectivity Platform for accelerating the devleopment of devices and appliances. The SBC platform based on Qualcomm® Dragonwing™ QCM4290 SoC can be customized to interface to cameras, displays, sensors and peripherals through its MIPI, USB & Low speed interfaces. The platform integrates heterogenous compute and WiFi/BT/LTE connectivity.

KEY FEATURES:

  • Reference design for biometric authentication and access control
  • Support for facial recognition
  • Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
Type Single-Board Computers
TurboX C4210 SOM

TurboX C4210 SOM (System On Module) is designed based on the Qualcomm® QRB4210 platform. It brings high-value features to mid-tier devices, designed to support advanced graphics, triple ISPs for advanced dual-camera experience, dedicated compute DSP for computer vision and video post-processing, etc. The form factor of the module is 34mm×35mm×2.9mm LGA package which can be fit into devices including robotics, dash camera, video conference, smart retail, etc. TurboX C4210 SOM is an ideal platform for both industrial and consumer applications requiring high data rates multimedia function and can help to rapidly develop cost-effective cellular devices to the market.

KEY FEATURES:

  • Qualcomm(R) Hexagon(TM) 683 DSP with dual-HVX512 for AI computing
  • Support up to 3 cameras
Chipset
Type System-on-Modules
Qualcomm® Robotics RB2 Platform (Qualcomm® QRB4210)

Dream up and deploy a new generation of everyday robotics and IoT products for the masses without sacrificing features or performance.


The Qualcomm Robotics RB2 platform integrates high-level features, AI solutions, and powerful performance in a unified, cost-effective solution giving OEMs, ODMs, and developers flexibility to design and create a generation of high-performance everyday robotics and IoT products.

The Qualcomm Robotics RB2 combines heterogeneous-compute performance and dedicated AI accelerator, communications technologies, and new levels of cost-effectiveness and accessibility for the industry. The platform is optimized for smaller devices and lower power consumption.

This extends to their built-in support for machine vision; support for up to three cameras, providing onboard intelligence to meld this data with other high-fidelity sensors from TDK for applications such as autonomous navigation.

KEY FEATURES:

  • Designed with CPU architectures for increased speeds and sustained performance
  • Dual-channel non-PoP high-speed memory
Chipset
Type Development Kits
TurboX AOCVS Reference Kit
TurboX AOCVS Reference Kit is a low power AI vision solution based on Qualcomm® AOCVS (Always On Computer Vision Sensor), which consists of an integrated ultra-low power imaging sensor and a processor running AI vision algorithms including face detection, people detection and object detection etc.

KEY FEATURES:

  • Ultra low power: Always-on intelligent vision @ < 1mW average end-to-end power
  • Low cost: Low single digits for HW & CV algorithms
  • Privacy: Images are not stored or emitted - send only data output
Chipset
MDM9205,QCC112
Type Reference Design Platforms
TurboX T95 SOM

The TurboX T95 SOM (System On Module) is based on new Qualcomm® MDM9205 modem and purpose-built for the low power wide area Internet of Things applications. It integrates all key innovations required to build cellular-enabled IoT products and services into a single module, including 3GPP Rel. 14 compliant LTE Cat M1/Cat NB2, E-GPRS connectivity, integrated GNSS, hardware-based security, capable of cloud services, and rich set of development tools.

KEY FEATURES:

  • Cat M1 & Cat NB2 & EGPRS
  • AT Command
  • GPS, GLONASS, Beidou, Galileo, QZSS
  • 3uA in PSM mode
  • >23 bands worldwide
  • Wi-Fi Position
  • LWM2M, CoAP, MQTT, FTP, TLS
  • OTA
Chipset
Type System-on-Modules
TurboX C610/C410 Open Kit
The TurboX C610/C410 SOM is an intelligent vision platform with powerful image processing and machine learning for smart camera and intelligent IoT devices. It’s powered by the Qualcomm® QCS610/QCS410 SoC (System-on-Chip), which is also known as Qualcomm® Vision Intelligence, platform providing a cost-effective solution to accelerate the product development and commercialization process. The C610/C410 SOM supports Linux and Android OS.
Type Development Kits
TurboX C4290/CM4290 SOM
The CM4290/C4290 SOM (System On Module) is designed based on the Qualcomm® QCM4290/QCS4290 platform. It brings high-value features to mid-tier devices, designed to support advanced graphics, fast LTE connectivity, triple ISPs for advanced dual-camera experience, dedicated compute DSP for computer vision and video post-processing, etc.

KEY FEATURES:

  • Qualcomm® Hexagon 683 DSP with dual-HVX512
  • BLE 5.1 compliant
  • Support up to 3 cameras
  • 1080P@60FPS video record and play
  • Wi-Fi 802.11a/b/n/ac LTE support
  • Qualcomm® Kryo™ 260 CPU:4 x A73@ 2.0GHz + 4 x A53@1.8GHz
TurboX C610 SOM
The C610 SOM is an intelligent vision platform with powerful image processing and machine learning for smart camera and intelligent IoT devices. It’s powered by the Qualcomm® QCS610 SoC (System-on-Chip), which is also known as Qualcomm® Vision Intelligence platform, providing a cost-effective solution to accelerate the product development and commercialization process.
Chipset
Type System-on-Modules
BG600L-M3 LPWA module
BG600L-M3 is a multi-mode LPWA module supporting LTE Cat M1/Cat NB2/EGPRS and integrated GNSS. It is 3GPP Rel. 14 compliant and offers maximum data rates of 588 kbps downlink and 1119 kbps uplink under LTE Cat M1. It features ultra-low power consumption by leveraging the integrated RAM/flash achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor.

KEY FEATURES:

  • LTE Cat M1/Cat NB2/EGPRS module with ultra-low power consumption
  • Support VoLTE for LTE Cat M1 and CS voice for GSM
  • Cost-effective SMT form factor of 18.7 mm × 16.0 mm × 2.1 mm
Chipset
Type System-on-Modules
LTE BG95-M3 Mini PCIe
BG95-M3 Mini PCIe is a multi-band LTE Cat M1/Cat NB2/EGPRS module adopting standard PCI Express® Mini Card form factor (Mini PCIe). It offers maximum data rates of 588 kbps downlink and 1119 kbps uplink. A rich set of Internet protocols, industry-standard interfaces and abundant functionalities (USB drivers for Windows 7/8/8.1/10, Linux, etc.) extend the applicability of the module to a wide range of M2M applications such as wireless POS, smart metering, tracking, etc.

KEY FEATURES:

  • Multi-band LTE Cat M1/Cat NB2/EGPRS module with global coverage
  • Multi-constellation GNSS receiver
Chipset
Type System-on-Modules
BG95 LPWA Cat M1/Cat NB2/EGPRS series
Based on the Qualcomm® 9205 LTE modem, BG95 is a series of multi-mode LPWA modules supporting LTE Cat M1/Cat NB2/EGPRS and integrated GNSS. It is 3GPP Rel. 14 compliant and offers maximum data rates of 588 kbps downlink and 1119 kbps uplink under LTE Cat M1. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption.
Chipset
Type System-on-Modules
BG77 LPWA module
BG77 is an ultra-compact LPWA module supporting LTE Cat M1, LTE Cat NB2 and integrated GNSS. It is fully compliant with 3GPP Rel.14 specification and provides maximum data rates of 588 kbps downlink and 1119 kbps uplink. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor.
Chipset
Type System-on-Modules
SLM156
MeigSmart SLM156 is a high-performance module with multiple modes of NB-IoT/Cat M/EGPRS using Qualcomm® MDM9205 LTE modem. It features extremely low power consumption and ultra-compact size of 21x20x2.3mm profile to ideally suit for size consious applications, such as smart metering, smart city and asset tracking. SLM156 supports LCC package which makes it an ideal solution for large-scale manufacturing. The complete GPS and Voice services meet client-side demands for wide range connectivity.

KEY FEATURES:

  • Supports Cat M1/NB-IoT/GPRS three-mode
  • Supports worldwide bands and long usage lifetimes
  • Enables the next generation of smart terminal and IoT products & solutions 
Chipset
Type System-on-Modules
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.

KEY FEATURES:

  • Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
  • 3rd generation Qualcomm® AI Engine
  • Vivid graphics with Qualcomm® Adreno™ 610 GPU
  • Multiple high speed connectivity options
  • Up to 6GB LPDDR4 and 256GB eMMC
  • Long term support with extended life hardware and software support through 2027
Chipset
Type System-on-Modules
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).

KEY FEATURES:

  • Development kit provides interfaces to evaluate camera and video
  • Evaluate display on LCD & HDMI
  • Supports many robotic features
Type Development Kits
Open-Q™ 610 μSOM
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.

KEY FEATURES:

  • SoC 11nm technology for high performance with low power
  • On-device artificial intelligence & machine learning
  • Native Ethernet interface for high speed connectivity
  • Three camera ports for multi-camera systems
  • Yocto Linux or Android 12 with connected camera SDK
  • RTSP streaming support with GStreamer
  • Multiple options for AI inference engines
Chipset
Type System-on-Modules
Open Q RB Development Kit
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs based on the Qualcomm® QRB4210 and Qualcomm® QRB2210 (Yocto Linux) processors. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.

KEY FEATURES:

  • The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
  • Supports many robotic features
  • User can expand the kit with compatible boards from 96Boards
Type Development Kits
Open-Q™ 4210 System in Package
The Open-Q™ 4210 Series SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QRB4210 (Yocto Linux) processors utilize Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4200 SIP creates the perfect computing core for a variety of edge AI video analytic applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:

  • Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
  • Vivid graphics with Qualcomm® Adreno™ 610 GPU
  • Up to 6GB LPDDR4 and 256GB eMMC
  • Long term support with extended life hardware and software support through 2027
Chipset
Type System-on-Modules
Open-Q™ 610 μSOM Development Kit
The Open-Q™ 610 µSOM Development Kit is a versatile, easy-to-use, exposed board platform, powered by our ultra-compact, production-ready, Open-Q™ 610 µSOM. The µSOM is based on the Qualcomm® QCS610 SoC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities and is aimed at visual intelligence applications.

KEY FEATURES:

  • Powered by micro-sized (50x25mm) Open-Q 610 µSOM
  • Open-frame Mini-ITX form-factor carrier board for evaluation and development
  • Numerous I/O and connectivity options
  • USB Type-C, USB Type-A, Gb Ethernet
Chipset
Type Development Kits