Industrial Infrastructure
Three new industrial-grade processor platforms, the Qualcomm Dragonwing™ IQ9, IQ8, and IQ6 Series, are purpose-built for demanding industrial applications. With up to 100 TOPS of on-device AI performance, extreme temperature tolerance, and available built-in safety features, these chipsets empower developers and enterprises to create purpose-built solutions across robotics, drones, industrial automation applications, and beyond.
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Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | Bluetooth Specification Version | Process Node and Technology Process Node |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm® Dragonwing™ IQ9 Series | ||||||||||||||||
IQ-9075 Active | Qualcomm® Kryo™ | 8 | Up to 2.36 GHz | Qualcomm® Adreno™ 663 | 800 MHz | 3200 MHz | LPDDR5 | — | 12 | 2x Display Serial Interface (DSI) | 21x QUP1 | Linux Yocto | Wi-Fi 4 | 802.11be | Bluetooth® 5.3 | 4 nm |
Qualcomm® Dragonwing™ IQ8 Series | ||||||||||||||||
IQ-8275 Active | Qualcomm® Kryo™ | 8 | Up to 2.35 GHz | Qualcomm® Adreno™ 623 | 877 MHz | 3200 MHz | LPDDR5x | 1x Qualcomm® Hexagon™ V66 | 5 | 1x 4-lane Display Serial Interface (DSI) | 1x QSPI | Linux Yocto | — | — | Bluetooth® 5.3 | 4 nm |
Qualcomm® Dragonwing™ IQ6 Series | ||||||||||||||||
IQ-615 Sampling | Qualcomm® Kryo™ 460 | 8 | Up to 1.9 GHz | Qualcomm® Adreno™ 612 | Up to 845 MHz | 1555 MHz | LPDDR4x | Qualcomm® Hexagon™ V66 | 3 | — | 100x GPIO | Linux Yocto | — | — | Bluetooth® 5.3 | — |
Qualcomm® Dragonwing™ IQ-X Series | ||||||||||||||||
IQ-X Series Active | Qualcomm® Oryon™ | 12 | 3.4 GHz | Qualcomm® Adreno™ | 1.25 GHz | 4200 MHz | LPDDR5x | Qualcomm® Hexagon™ V73M | — | 1x 4-lane Embedded DisplayPort (eDP) | QUP | Windows | — | — | — | — |
- Supports UART/I2C/SPI
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