Developer
Qualcomm Dragonwing™ IoT
for Developers

A comprehensive developer offering 
for AI-Accelerated IoT
 

Accelerate your edge AI development with Qualcomm Dragonwing IoT hardware, software, and services, built on leading AI, compute, and connectivity technologies.

Our comprehensive offering starts with our high-performance silicon that has been optimized for IoT and edge AI. Choose from a range of development kits for prototyping, to deploying models that scale for industrial solutions. You'll find developer-friendly software like Edge Impulse and the Qualcomm® Visual Studio Code Extension to help you build, test, and scale intelligent edge AI solutions. Dragonwing supports your IoT development journey across multiple OSs, dedicated SDKs, containers, advanced IDEs, and custom applications.

Dragonwing IoT Offering

A range of tools, platforms, and technologies are available for you to create, deploy, and scale your IoT projects and unlock new possibilities.

Choose your Hardware Kit

An array of developer kits for rapid prototyping to scalable industrial projects include:

Rubik Pi Development Board

Affordable, open-source board for prototyping.

 

Ideal for:
Robotics, computer vision, audio.

 IOT

Arduino® UNO Q

Next-generation developer board combining an AI-capable MPU with a real-time MCU for edge innovation.

  • Run complex applications while maintaining precise, real-time control on a single board.
  • Seamless expansion and prototyping with Arduino hardware and software ecosystem.

 IOT

Qualcomm Dragonwing™ RB3 Gen 2 Development Kit

Use Cases: Computer vision, Dash Cam, Industrial hand held, etc.

  • Affordable Dev kit runs Qualcomm® Linux® out of the Box
  • Comes with pre-integrated camera sensors and industrial sensors

IQ-9075 Evaluation Kit (EVK)

High performance kits for extreme environments.

 

Ideal for:
Edge Ai and surveillance.

Components 
and Peripherals

Dragonwing developer kits support:

  • Heterogeneous compute: CPU, GPU, NPU, ISP, and audio
  • Multi-camera and display support
  • Expansion via PCIE, MIPI CSI, GPIO, UART, SPI, I2C, I2S
  • Sensor integration: temperature, acceleration, pressure
  • Connectivity: Wi-Fi, Bluetooth, Ethernet 

Deploy AI on Edge AI and Development Platforms

Bringing intelligence to the edge in your IoT projects has never been simpler. Use our AI development platforms to build faster and start inferencing quickly.

Build, train, and deploy models at the edge in minutes.

Optimize and deploy your own models or use pre-trained ones from a rich model library.

Sample apps

Qualcomm Technologies’ Sample IoT Apps

Sample Apps created by Qualcomm Technologies engineers.

Community Sample Apps

Growing collection of community GitHub repos.

Resources to get started

VIDEO

Getting Started with IoT AI on Qualcomm Dragonwing with Edge Impulse

Feb 5, 2026 | 15:00

VIDEO

Live Build Along: AprilTag and Qualcomm RB3 Gen 2

Feb 5, 2026 | 15:00

blog

Meet Arduino UNO Q: Qualcomm Dragonwing fueled AI in a blink

Feb 5, 2026 | 15:00

Discover our latest insights

Open-Q™ 2210 System in Package
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:

  • Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
  • Secure compute platform
  • Extended Operating Temperature (-25C to 85C)
By:Lantronix Inc.
Chipset:
QRB2210
Open-Q IQ6 SOM
The Open-Q™ IQ6 SOM module family is powered by the Qualcomm IQ615 processor, which features Qualcomm’s powerful image signal processor (ISP) and a heterogeneous computing architecture. The IQ-615’s ability to operate in wide thermal junction temperatures ranging from -40° to +105° makes the Open-Q™ 615IQ ideally suited for many industrial-grade use cases, including industrial gateways, controllers, smart controllers, industrial HMIs, and more.

KEY FEATURES:

  • Up to 8GB LPDDR4x RAM
  • Up to 128GB UFS with SDIO storage support
  • SMARC form factor
  • Qualcomm Linux
  • Industrial temperature availability
  • Optional pre-certified Wi-Fi/BT
  • Customizable memory and storage options
By:Lantronix Inc.
Chipset:
QCS615
Open-Q 8550CS SoM
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.

KEY FEATURES:

  • Up to 16GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13 and Linux Yocto Kirkstone
  • On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
By:Lantronix Inc.
Chipset:
QCS8550
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.

KEY FEATURES:

  • Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
  • 3rd generation Qualcomm® AI Engine
  • Vivid graphics with Qualcomm® Adreno™ 610 GPU
  • Multiple high speed connectivity options
  • Up to 6GB LPDDR4 and 256GB eMMC
  • Long term support with extended life hardware and software support through 2027
By:Lantronix Inc.
Chipset:
QCS4290

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