Build edge solutions on your terms.
A robust ecosystem, from initial code to final product.
Qualcomm supports IoT development with a complete set of tools, hardware, and software. Our integrated system helps you transition easily from prototype to production, empowering you to realize your IoT ideas.
Build and scale edge AI applications on devices powered by Qualcomm Dragonwing™ processors. Access the hardware, software, and tools you need to develop and deploy solutions.
Hardware for IoT Development
An array of IoT evaluation and development kits, powered by Dragonwing processors, are backed by an ecosystem of developer tools, so you can prototype quickly and scale up to complex, commercial products.
Rubik Pi Development Board
Affordable, open-source board for prototyping.
Ideal for:
Robotics, computer vision, audio.
ARDUINO® UNO Q Board
Dragonwing™ QRB2210 processor + STM32U5 MCU (dual architecture) | Linux + real time control | Integrated Wi Fi 5 + Bluetooth ® 5.1
Use for:
- Rapid IoT and edge AI prototyping for lightweight, entry-level, or budget-friendly scenarios.
- Edge AI vision and perception, smart sensing, and telemetry real-time detection, environmental sensing, local logic.
- Hybrid real-time control and interactive AI systems and vision-based human-aware systems.
ARDUINO® VENTUNO™ Q Board
Dragonwing™ IQ 8275 + STM32H5 (dual architecture) | Up to 40 TOPS AI performance | Integrated Wi Fi 6 + Bluetooth 5.3
Use for:
- Autonomous physical agents that incorporate LLMs, vision-language models (VLMs), local reasoning, and autonomous execution.
- AI robotics platforms like autonomous mobile robots (AMRs) with visual simultaneous localization and mapping (SLAM) and human-machine interactions like automatic speech recognition (ASR), text-to-speech (TTS), and gesture recognition.
- Vision-assisted automation, such as smart camera systems, monitoring, and inventory detection.
Dragonwing™ IQ-8275 Evaluation Kit (EVK)
Dragonwing™ IQ-8275 processor | Up to 40 TOPS AI performance | Qualcomm® Hexagon™ Tensor Processor | Integrated Wi Fi 6E + Bluetooth 5.3 | Ubuntu®, Upstream Linux® with Yocto Support | Up to 12 concurrent camera connections
Use for:
- Edge AI processing and edge gateways incorporating small language models (SLMs), VLMs, LLMs, data aggregation, IoT connectivity, and edge AI inferencing.
- Sensor fusion and robotics systems, such as video processing, fleet management, drones, AMRs, cobots, palletizers, compact robots, drones, and robotic arms.
- Industrial vision and control systems like smart sensors, industrial controllers, inspection, quality control, and safety monitoring.
Dragonwing™ IQ-9075 Evaluation Kit (EVK)
Dragonwing™ IQ 9075 processor | Up to 100 TOPS AI performance | Dual Hexagon Tensor Processors | Integrated Wi Fi 6E + Bluetooth 5.3 | Ubuntu®, Upstream Linux with Yocto Support | Up to 16 concurrent camera connections
Use for:
- Agentic local AI processing and advanced AI models like LLMs with two concurrent LLMs, VLMs, compute, smart vision, and language processing.
- Industrial robotics and automation include complex AMRs, robots, UAVs/drones, agriculture and industrial robotics, intelligent inspection, and factory automation.
- Multi-sensor and large-scale edge AI systems incorporating camera fusion for surveillance, navigation, process automation, industrial IoT, smart cities, retail, or healthcare.
IQ-9075 Evaluation Kit (EVK)
High performance kits for extreme environments.
Ideal for:
Edge Ai and surveillance.
KEY FEATURES:
- Snapdragon S7 Gen 1 Sound Platforms
- Development Kit
- QCC7228 + QCP7321
KEY FEATURES:
- Snapdragon S7 Gen 1 Sound Platforms
- Development Kit
- QCC7228 + QCP7321
KEY FEATURES:
- Dragonwing IQ-X processors
- Up to 12 Qualcomm® Oryon™ CPU cores
- Qualcomm® Hexagon™ NPU with 45 TOPS
- High-performance Qualcomm® Adreno™ GPU
- PCI Express Gen 4 | USB 4
- Industrial Temperature Range -40°C to +85°C
KEY FEATURES:
- Dragonwing IQ-X processors
- Up to 12 Qualcomm® Oryon™ CPU cores
- Qualcomm® Hexagon™ NPU with 45 TOPS
- High-performance Qualcomm® Adreno™ GPU
- PCI Express Gen 4 | USB 4
- Industrial Temperature Range -40°C to +85°C
KEY FEATURES:
- Low Power Dual-Band 1x1 module for Wi-Fi & Bluetooth®
- Based on the QCA9377-3 chipset
- 802.11 a/b/g/n/ac Wave 2 MU-MIMO
- Bluetooth 5.0 BR/EDR/LE Smart Ready
- SDIO 3.0 WLAN host interface
- On-chip Power Management Unit (PMU)
- Link Rate upto 433 Mbps
- On-board and u. antenna options
- Supports enterprise security, seamless roaming and CCX
- Fine tuned calibration per module
- FCC/IC/CE/MIC modular certification
- Connector mount, surface mount, and SDIO card form factor
KEY FEATURES:
- Low Power Dual-Band 1x1 module for Wi-Fi & Bluetooth®
- Based on the QCA9377-3 chipset
- 802.11 a/b/g/n/ac Wave 2 MU-MIMO
- Bluetooth 5.0 BR/EDR/LE Smart Ready
- SDIO 3.0 WLAN host interface
- On-chip Power Management Unit (PMU)
- Link Rate upto 433 Mbps
- On-board and u. antenna options
- Supports enterprise security, seamless roaming and CCX
- Fine tuned calibration per module
- FCC/IC/CE/MIC modular certification
- Connector mount, surface mount, and SDIO card form factor
KEY FEATURES:
- Octal Core CPU powered by the Dragonwing IQ-615 Processor from Qualcomm
- Dual-core CPU, up to 1.9 GHz
- Hexa-core CPU, up to 1.6 GHz
- Adreno 612 GPU
- Hexagon™ V66 DSP with Dual hexagon Vector (1.1 TOPs)
- Qualcomm Spectra™ 230 image processing engine (ISP)
- Adreno 443 VPU Video Decode/Encode 4k60(D)/1k60/(E)
- Up to 8GB LPDDR4x SDRAM 3110MT/s
- Up to 256GB eMMC Flash, up to 256GB UFS Flash (option)
- Up to 5x USB 2.0, 2x USB 3.1, 1x SDIO
- Up to 2x PCIe Gen2 (2x 1 Lane)
- MIPI-DSI or dual channel LVDS
- 1x DP v.1.4 (up to 4 Displays)
- 3x MIPI-CSI
- Up to Dual Gigabit Ethernet
- 3x UART, 1x SPI, 1x QSPI/SPI, 5x I2C, 2x I2S Audio
- 1x TPM 2.0 (optional)
- Yocto Linux, Ubuntu (on request)
- Optimized design for low cost and low power applications
KEY FEATURES:
- Octal Core CPU powered by the Dragonwing IQ-615 Processor from Qualcomm
- Dual-core CPU, up to 1.9 GHz
- Hexa-core CPU, up to 1.6 GHz
- Adreno 612 GPU
- Hexagon™ V66 DSP with Dual hexagon Vector (1.1 TOPs)
- Qualcomm Spectra™ 230 image processing engine (ISP)
- Adreno 443 VPU Video Decode/Encode 4k60(D)/1k60/(E)
- Up to 8GB LPDDR4x SDRAM 3110MT/s
- Up to 256GB eMMC Flash, up to 256GB UFS Flash (option)
- Up to 5x USB 2.0, 2x USB 3.1, 1x SDIO
- Up to 2x PCIe Gen2 (2x 1 Lane)
- MIPI-DSI or dual channel LVDS
- 1x DP v.1.4 (up to 4 Displays)
- 3x MIPI-CSI
- Up to Dual Gigabit Ethernet
- 3x UART, 1x SPI, 1x QSPI/SPI, 5x I2C, 2x I2S Audio
- 1x TPM 2.0 (optional)
- Yocto Linux, Ubuntu (on request)
- Optimized design for low cost and low power applications
What can you build?
Below is a sampling of projects and commercial applications that can be developed using the Qualcomm® IoT ecosystem.
AI Camera Prototype
Camera hardware + edge AI accelerator + computer vision model + Qualcomm® AI Runtime
Robotic Proof-of-Concept
Robotics platform + cameras and sensors + ROS 2 + QIRP SDK + AI perception
Autonomous Mobile Robot
Mobile robot platform + multi-sensor perception + ROS 2 + QIRP SDK + real-time edge AI
AI Camera Prototype
Camera hardware + edge AI accelerator + computer vision model + Qualcomm® AI Runtime
Robotic Proof-of-Concept
Robotics platform + cameras and sensors + ROS 2 + QIRP SDK + AI perception
Autonomous Mobile Robot
Mobile robot platform + multi-sensor perception + ROS 2 + QIRP SDK + real-time edge AI
Industrial IoT Automation
Industrial sensors + Dragonwing™ platform + anomaly detection + Qualcomm® Linux® + automation software
Smart Sensors
Low-power sensors + compact ML model + Edge Impulse + on-device inference + wireless connectivity
Machine Vision Systems
Industrial cameras + ISP/CVP + image-processing pipeline + vision models + Qualcomm AI Runtime
Industrial IoT Automation
Industrial sensors + Dragonwing™ platform + anomaly detection + Qualcomm® Linux® + automation software
Smart Sensors
Low-power sensors + compact ML model + Edge Impulse + on-device inference + wireless connectivity
Machine Vision Systems
Industrial cameras + ISP/CVP + image-processing pipeline + vision models + Qualcomm AI Runtime
Development hardware for every stage
Start exploring with accessible development boards or scale up with high-performance evaluation kits — all powered by Qualcomm® silicon.
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
- Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
- 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
- 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
- Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
- Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
- Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
Tools that meet you at every stage
Every IoT project is unique. Here's a look into the ecosystem that supports you — from first boot to deployment.
01
Operating Systems
Optimized for Dragonwing
Familiar desktop environment & app layer
Enterprise-ready Android OS, backed by a board support package
Use standard Windows tools to leverage hardware capabilities
02
Development Environment
Qualcomm plugin for simplified IoT dev
The unified environment for creating Arduino Apps
Remote access to real Dragonwing evaluation kits for testing
03
AI & ML
On-device model optimization & profiling
Train & deploy ultra-low latency edge ML models
AI Model Efficiency Toolkit (AIMET)
State-of-the-art model quantization & compression
04
SDKs
Hardware-accelerated neural network runtime
Qualcomm® Intelligent Multimedia SDK
Advanced multimedia & camera perception pipeline
Qualcomm® Intelligent Robotics Product
A collection of Robotics components for Qualcomm platforms
05
Deployment & Scaling
OTA Management
Industrial-grade Linux OS & secure OTA fleet management
Accelerate from concept to launch with ready-to-use partner modules built to scale your IoT designs faster
AIMET is a product of Qualcomm Innovation Center, Inc.
Projects & Learning Resources
Find projects and resources to kick-start your IoT development.
IoT Project Hubs
Arduino Project Hub
A community-driven platform where makers discover, share, and collaborate on Arduino-based projects and tutorials spanning a wide range of applications.
Robotics Hub
A curated robotics development hub for Arduino projects, featuring projects, sample applications, and reference builds to speed up prototyping and development.
Qualcomm Community Projects on GitHub
Real projects from our global developer community – from student ambassadors to professional engineers.
QUALCOMM PARTNER NETWORK
Scale your design with our partners
Accelerate from concept to launch with ready-to-use partner modules built to scale your IoT designs faster.
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Qualcomm Ambassador Program
Join a global community of innovators. Whether you're building AI-powered applications, connected devices, robotics, XR experiences, or IoT solutions, the Qualcomm Ambassador Program gives you opportunities to learn, grow, and make an impact. Collaborate with fellow developers, create technical content, participate in events, and gain visibility for your work across the Qualcomm Developer ecosystem.
