Product Responsibility

Practicing precaution.

We address the sustainability of our products through our Environmental Management System and various hazardous-substance elimination programs. We practice the “precautionary principle,” taking preventative measures regarding certain chemicals, even if science hasn’t indicated clear environmental or health hazards. Our own policies are often more stringent than applicable law.

Getting the lead out.

The health and environmental hazards of lead are well documented. We have been proactive in removing lead from our products since 1999. Following our successful introduction of lead-free flip-chips in 2010, we now incorporate lead-free design in all new integrated-circuit products, whenever technically and economically feasible.

Eliminating bromine and chlorine.

Although regulations do not prohibit the use of all brominated and chlorinated compounds in our products, we have been proactive in eliminating them because of the potential hazards they pose.

Removing lead, bromine and chlorine from our products.

1999

We began exploring lead removal from our semiconductor products, well ahead of European regulation.

2003

We became one of the leading semiconductor makers to introduce lead-free chip-scale package products. We incorporated bromine-free mold compounds.

2006

The European Union’s Restriction on Hazardous Substance (RoHS) Directive, restricting lead in electrical and electronic equipment, took effect. All our semiconductor products met the ROHS maximum concentration values’ requirements.

2009

We incorporated a bromine/chlorine-free package design in all new integrated-circuit products. We converted a number of high-volume legacy products to bromine/chlorine-free designs.

2010

We introduced several lead-free flip-chip semiconductor products.

Today

We incorporate lead-free design into new semiconductor products whenever technically and economically feasible.

Conforming to regulations wherever we do business. 

We conform to all applicable laws regulating the materials in our products. The following are among the ways we conform:

 

Other substances we don’t use.

We began prohibiting and restricting the intentional use of certain hazardous substances in our semiconductor business’s integrated-circuit product design in 2003. Today our list of prohibited or restricted substances for those products includes:

  • Antimony
  • Asbestos
  • Azo compounds
  • Brominated flame retardant and chlorinated flame retardant
  • Bromine
  • Cadmium and cadmium compounds
  • Chlorinated paraffins (CP)
  • Chlorine
  • 4,4’-Diaminodiphenylmethane (MDA)
  • Diarsenic pentoxide (As205)
  • Diarsenic trioxide (As203)
  • Formaldehyde
  • Hexabromocycododecane (HBCDD) and all major diastereoisomers
  • Hexavalent chromium compounds
  • Lead and lead compounds
  • Mercury and mercury compounds
  • Mirex (perchlorodecone)
  • Organic tin compounds (tributyl tin, tributyl tin oxide and triphenyl tin)
  • Ozone-depleting substances
  • Perfluorooctane sulfonates (PFOS)/Perfluorooctanoic acid (PFOA)
  • Phthalates (DEHP, DBP, BBP)
  • Polybrominated diphenyl ethers (PBDEs)
  • Polybromobiphenyls (PBBs)
  • Polychlorinated biphenyls (PCBs)
  • Polychlorinated naphthalenes (PCNs)
  • Polychlorinated terphenyl (PCT)
  • Polyvinyl chloride (PVC) and PVC blends
  • Radioactive substances
  • 5-tert-butyl-2, 4,6-trinitro-m-xylene (Musk xylene)
  • Tetrabromobisphenol A (TBBPA)