The health and environmental hazards of lead are well documented. We have been proactive in removing lead from our products since 1999. Following our successful introduction of lead-free flip-chips in 2010, we now incorporate lead-free design in all new integrated-circuit products, whenever technically and economically feasible.
Although regulations do not prohibit the use of all brominated and chlorinated compounds in our products, we have been proactive in eliminating them because of the potential hazards they pose.
We began exploring lead removal from our semiconductor products, well ahead of European regulation.
We became one of the leading semiconductor makers to introduce lead-free chip-scale package products. We incorporated bromine-free mold compounds.
The European Union’s Restriction on Hazardous Substance (RoHS) Directive, restricting lead in electrical and electronic equipment, took effect. All our semiconductor products met the ROHS maximum concentration values’ requirements.
We incorporated a bromine/chlorine-free package design in all new integrated-circuit products. We converted a number of high-volume legacy products to bromine/chlorine-free designs.
We introduced several lead-free flip-chip semiconductor products.
We incorporate lead-free design into new semiconductor products whenever technically and economically feasible.
We conform to all applicable laws regulating the materials in our products. The following are among the ways we conform:
We began prohibiting and restricting the intentional use of certain hazardous substances in our semiconductor business’s integrated-circuit product design in 2003. Today our list of prohibited or restricted substances for those products includes: