The Qualcomm Dragonwing™ X100 Accelerator Card is an optimized and virtualized product, with integrated hardware acceleration completely independent of CPUs, designed to deliver highperformance, low-latency, and power-efficient vDU servers. It supports cloud-native and virtualized 5G network deployments by offloading server CPUs from compute-intensive 5G baseband processing, resulting in increased performance and lower total cost of ownership (TCO) by reducing power consumption and the numbers of CPUs and cores required by up to 50%.

The Qualcomm Dragonwing™ X100 Accelerator Card is an O-RAN compliant solution, supporting a range of baseband function split options—including all 7.x split functions, as well as future split options (e.g., 7.3).

The Qualcomm Dragonwing™ X100 Accelerator Card comes with an integrated network interface card (NIC) for Fronthaul with High-PHY functions. This integrated solution provides OEMs and operators with deployment flexibility and facilitates scalable and cost-effective 5G RAN network. The solution is designed with an upgradable architecture of L1 software to enable rapid rollout of future 3GPP release features, extend platform lifespan, and help reduce total cost of ownership.

The Qualcomm Dragonwing™ X100 Accelerator Card is a PCIe inline accelerator card with sub-6GHz baseband support, designed to simplify 5G deployments by offering a customizable plug-in solution with commercial-grade Layer 1 (L1) software updated to the latest 3GPP specification. The Qualcomm Dragonwing X100 Accelerator Card also offers integrated O-RAN Fronthaul and 5G NR Layer 1 High (L1 High) processing, including beamforming processing and support for simultaneous Massive MIMO 64T64R sectors, that will improve user experiences by helping virtualized and open RAN platforms to support the high-capacity and lowlatency workloads of future networks.