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CQ10
CQ10 is an LTE Cat 1 module with 2G fall back supporting 3GPP release 10 designed for IoT and M2M applications. It delivers a maximum data rate of 10 Mbit/s DL & 5 Mbit/s UL. It has a compact LGA form factor. CQ10 supports In-built GNSS with Qualcomm® Location Suite Gen8C Lite (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS), for precise and dependable positioning. CQ10 supports VoLTE and SMS over IMS/SG/CS and supports wide set Internet protocols and industry-standard interfaces. The CQ10 Module is available in five regional variants, CQ10-EAJ for Eurasia & Japan, CQ10- NA for North America CQ10-IN for India, CQ10-AN for Australia & New Zealand, CQ10-LA for Latin America along with a worldwide variant, CQ10-WW, for global deployments. CQ10 is ideal for IoT applications such as asset tracking, automotive, e-mobility, data loggers, fleet management and environmental monitoring.

KEY FEATURES:

  • LTE Cat 1 with 2G Fall back
  • In-built GNSS, Arm Cortex A7 up to 1.3GHz
  • Open SDK Support, DFOTA
  • Form Factor: LCC+LGA
Chipset
Type System-on-Modules
Crystal Resonator
Product Description: Crystal Unit SMD 1.2x1.0 76.8MHz TST Part No.: TZ3770AAAI82

KEY FEATURES:

  •  Excellent Reliability Performance with good Frequency Perturbation and Stability over temperature
  • Ultra Miniature Package with Surface Mount Hermetic Package
  • Moisture Sensitivity Level (MSL): Level-1
Chipset
Type Reference Design Platforms
NOVA327D-A
Wi-Fi 2x2 802.11a/b/g/n/ac AP module is based on Qualcomm® QCA9563 platform.
Chipset
Type System-on-Modules
NL02-A
LTE to Wi-Fi conversion module utilizes Qualcomm® QCA9531, Qualcomm® QCA9887 and Qualcomm® MDM9607 chipset platforms.
NOVA95HD-A
Wi-Fi 2x2 802.11a/b/g/n/ac AP Module is based on Qualcomm® QCA8075 and Qualcomm® IPQ4019 processors.
Chipset
QCA8075,IPQ4019
Type System-on-Modules
NL03-A
LTE to Wi-Fi conversion module utilizes Qualcomm® QCA8337, Qualcomm® QCA9550 and Qualcomm® IMDM9607chipset platforms.
Chipset
QCA8337,QCA9550,MDM9607
Type System-on-Modules
Habanero DVK
The Habanero DVK is a development kit specifically engineered for Habanero SOM. It leverages the capabilities of the Qualcomm® IPQ4019/IPQ4029 SoC, which features a quad-core processor with NEON and FPU support. This powerful combination ensures outstanding performance, making it ideal for resource-intensive networking applications, such as routers, gateways, and access point development.Equipped with a high-power, dual-band concurrent radio, the Habanero DVK supports WiFi 5 technology, enabling reliable and fast wireless connectivity. It also incorporates the Qualcomm ® QCA8075C PHY, which provides support for five Gigabit Ethernet ports, delivering high-speed and reliable wired networking capabilities.

KEY FEATURES:

  • Dev Kit•   USB 3.0 and 2.0 port•   Easy connectivity with external devices•   Additional interfaces that can be configured as general-purpose I/O pinsSW options•   The embedded Linux framework FirmUx from 8devices•   OpenWRT
Chipset
Type Development Kits
Habanero
Habanero system on module (SOM) is based on an IPQ4019/IPQ4029 SoC from Qualcomm Technologies. Designed for demanding applications such as routers, gateways, and access points, Habanero offers a high-power, dual-band concurrent radio that supports WiFi 5 technology. Additionally, the QCA8075C PHY provides support for five Gigabit Ethernet ports, while Habanero also features one USB3.0 and one USB2.0 port and can accommodate other miscellaneous interfaces that can be configured as general-purpose I/O pins. With a hardware-based NAT engine and security features such as a crypto engine and secure boot, Habanero is an excellent choice for hast, secure networking applications. The Habanero SOM supports the embedded Linux framework FirmUx from 8devices, providing programmers with a flexible platform for developing a range of software applications. Software can be also built by using OpenWRT.

KEY FEATURES:

  • Max output power up to 22 dBm per chain | Power supply 3.3 V, max power consumption 11.5W | 46xGPIO, 1xPCie 2.0, 1xUSB3.0, 1xUSB2.0, 2xUART, 1xSPI, 2xI2C, 4PWM, 1xJTAG, 1xI2S/TDM, 5x1000/100/10 ethernets, 1xRGMII, 1xSDIO3.0/eMMC and parallels for NAND flash memory and LCD controller |
Chipset
Type System-on-Modules
SIM7500A
LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact product design.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7500A is compatible with the SIM7600/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7500JE
LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact product design.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7500JE is compatible with the SIM7600/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7500E
LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts a LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products design.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7500E is compatible with the SIM7600/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7500V
LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products design.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7500V is compatible with the SIM7600/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7600A
LTE Cat.1 Module. The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts a LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600/SIM7600-H series(LTE modules) , which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for a customer.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600A is compatible with the SIM7500/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7500JC
LTE Cat.1 The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts a LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products designs.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7500JC is compatible with the SIM7600/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7600SA
LTE Cat.1 Module The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts a LCC1 form factor and is compatible with SIM5320/SIM5360 series(UMTS/HSPA+ modules), and SIM7600/SIM7600-H series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for a customer.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600SA is compatible with the SIM7500/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7500SA
LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts a LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products designs.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7500SA is compatible with the SIM7600/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7600E
LTE Cat.1 Module The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600/SIM7600-H series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverageAbundant software functions: FOTA, LBS, TLS, VoLTEAT commands of the SIM7600E is compatible with the SIM7500/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7600SA-H
LTE Cat.4 Module The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverageAbundant software functions: FOTA, LBS, TLS, VoLTEAT commands of the SIM7600SA-H is compatible with the SIM7500/SIM7600 series modules
SIM7600G-H
LTE Cat.4 Module. SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600G-H is compatible with the SIM7500/SIM7600 series modules
SIM7600G
LTE Cat.1 Module. The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600/SIM7600-H series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for a customer.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600G is compatible with the SIM7500/SIM7600-H series modules
Chipset
Type System-on-Modules
SIM7600JC-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600JC-H is compatible with the SIM7500/SIM7600 series modules
SIM7600V-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600V-H is compatible with the SIM7500/SIM7600 series modules
SIM7600E-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600E-H is compatible with the SIM7500/SIM7600 series modules
SIM7600A-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600A-H are compatible with the SIM7500/SIM7600 series modules
ATXX 5G Starter Kit
Start your next 5G product with ATXX! This starter kit includes: 1 x Quectel RM500Q module (based on the Qualcomm® Snapdragon™ X55 modem) and 4 x ATXX 5G PCB antennas Order number: ATXX-DY-2011150

KEY FEATURES:

  • One 5G Quectel modem module, RM500Q
  • Four ATXX PCB antennas, designed for use with the Quectel modem
Chipset
Type Evaluation Boards
4G module N720
N720 is an industrial grade LTE module that is developed on Qualcomm(r) MDM9607 platform and supports global network standards. As the smallest module of the same type, its dimensions are only 30 mm x 28 mm x 2.8 mm. With its industrial design and reliable performance, it is well applicable to AMR, in-vehicle computers, handheld POS, industrial routers, etc.

KEY FEATURES:

  • Support Cat 4 and Cat 1 and embedded rich network protocols
  • Precise positioning (GPS, BDS, GLONASS) to help customers to manage devices based on location
  • Industrial design, ultra-wide range of operating temperature -40 °C to +85°C
  • Supports Linux
Chipset
Type System-on-Modules
N75 4G data module
N75 is an LTE Cat-4 module optimized specially for M2M and IoT applications. Adopting the 3GPP Rel. 11 LTE technology, it delivers 150Mbps downlink and 50Mbps uplink data rates. N75 is based on Qualcomm® MDM9207 and support Qualcomm(r) IZat™ location technology Gen8C Lite (GPS, GLONASS, BDS, Galileo and QZSS). The integrated GNSS greatly simplifies product design, and provides quicker, more accurate and more reliable position fix.

KEY FEATURES:

  • Low power consumption and ultra wide operating temp range
  • Industry interfaces and USB serial drivers for Windows 7/8/8.1/10, Linux, Android
  • Suitable for energy metering, industrial router, industrial PAD, video surveillance, environmental monitoring
Chipset
Type System-on-Modules
EM7511
The EM7511 module offers unprecedented LTE speeds, bandwidth, and network performance on the M.2 form factor, enabling secure and reliable public safety communications on the FirstNet Band 14 spectrum. Leveraging LTE-LAA and CBRS unlicensed bands and carrier aggregation, this LTE-Advanced Pro Cat-12 is ideal for public safety, industrial M2M, and mobile computing solutions.

KEY FEATURES:

  • Delivers up to 600Mbps downlink and 150Mbps uplink speeds
  • Certified by the FCC for CBRS private networks
  • Approved by AT&T for FirstNet public safety network
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou, Galileo)
  • Automatic 3G fallback networks
Chipset
MDM9250
Type System-on-Modules
EM7565
The EM7565 offers global 4G coverage, unprecedented LTE speeds, bandwidth, and network performance on the M.2 form factor. Leveraging LTE-LAA and CBRS unlicensed bands and carrier aggregation, this LTE-Advanced Pro Cat-12 embedded module is ideal for mobile computing, networking, and industrial M2M applications.

KEY FEATURES:

  • Delivers up to 600Mbps downlink and 150Mbps uplink speeds
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou and Galileo satellite systems supported)
  • Certified by the FCC for CBRS private networks
Chipset
MDM9250
Type System-on-Modules
MC7431
The MC7431 delivers high speed connectivity in Japan, offering a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation. Based on the PCI Express Mini Card standard with USB 3.0 and USB 2.0 interfaces, this LTE-A Cat-7 embedded module offers support for sXGP and is ideal for industrial M2M and mobile computing solutions.

KEY FEATURES:

  • Delivers 150Mbps uplink speed
  • Certified by JPF/JPA for the sXGP private network
  • GNSS (GPS, GLONASS, Galileo, BeiDou) has a dedicated GPS connector with GPS bias or shared on diversity
Chipset
MDM9250
Type System-on-Modules
MC7421
The MC7421 delivers high speed connectivity in EMEA and APAC, offering a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation. Based on the PCI Express Mini Card standard with USB 3.0 and USB 2.0 interfaces, this LTE-A Cat-7 embedded module is ideal for industrial M2M and mobile computing solutions.

KEY FEATURES:

  • Delivers 150Mbps uplink speed
  • Supports private LTE bands for enhanced data security and improved network performance
  • GNSS (GPS, GLONASS, Galileo, BeiDou) has a dedicated GPS connector with GPS bias or shared on diversity
Chipset
MDM9250
Type System-on-Modules
EM7431
The EM7431 delivers high speed connectivity in Japan, offering a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation. Based on the PCI Express M.2 standard with USB 3.0 and USB 2.0 interfaces, this LTE-A Cat-7 embedded module offers support for sXGP and is ideal for industrial M2M and mobile computing solutions.

KEY FEATURES:

  • Delivers 150Mbps uplink speed
  • Certified by JPF/JPA for the sXGP private network
  • GNSS (GPS, GLONASS, Galileo, BeiDou) has a dedicated GPS connector with GPS bias or shared on diversity
Chipset
MDM9250
Type System-on-Modules
MC7411
The MC7411 delivers high speed connectivity in North America, offering a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation. Based on the PCI Express Mini Card standard with USB 3.0 and USB 2.0 interfaces, this LTE-A Cat-7 embedded module is ideal for public safety, industrial M2M, and mobile computing solutions.

KEY FEATURES:

  • Delivers 150Mbps uplink speed
  • Certified by the FCC for CBRS private networks
  • Approved by AT&T for FirstNet public safety network
  • GNSS (GPSS, GLONASS, BeiDou, Galileo) has a dedicated GPS connector with GPS bias or shared on diversity
Chipset
MDM9250
Type System-on-Modules
EM7421
The EM7421 delivers high speed connectivity in EMEA and APAC, offering a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation. Based on the PCI Express M.2 standard with USB 3.0 and USB 2.0 interfaces, this LTE-A Cat-7 embedded module is ideal for industrial M2M and mobile computing solutions.

KEY FEATURES:

  • Delivers 150Mbps uplink speed
  • Supports private LTE bands for enhanced data security and improved network performance
  • GNSS (GPS, GLONASS, Galileo, BeiDou) has a dedicated GPS connector with GPS bias or shared on diversity
Chipset
MDM9250
Type System-on-Modules
EM7690
Offering global LTE connectivity with approvals from multiple NAM, EMEA, and APAC carriers, the EM7690, based on the Qualcomm® Snapdragon™ X55 modem system, provides an easy upgrade path to next-generation cellular technologies and global access to LTE-Advanced Pro high speed cellular networks. Supporting USB 3.1 and PCIe gen 3 single lane interfaces, this Cat-20 embedded module is ideal for a wide range of industrial M2M and mobile computing solutions.

KEY FEATURES:

  • Up to 2Gbps downlink and 211Mbps uplink speeds
  • 3GPP Rel-15 compliant
  • Automatic 3G fallback network
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
Chipset
Type System-on-Modules
EM7411
Based on Qualcomm® MDM9250 processor, the EM7411 delivers high speed connectivity in North America, offering a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation. Based on the PCI Express M.2 standard with USB 3.0 and USB 2.0 interfaces, this LTE-A Cat-7 embedded module is ideal for public safety, industrial M2M, and mobile computing solutions.

KEY FEATURES:

  • Delivers 150Mbps uplink speed
  • Certified by the FCC for CBRS private networks
  • Approved by AT&T for FirstNet public safety network
  • GNSS (GPSS, GLONASS, BeiDou, Galileo) has a dedicated GPS connector with GPS bias or shared on diversity
Chipset
MDM9250
Type System-on-Modules
EM9190
Offering global 5G connectivity, the EM9190 is designed in an M.2 form factor and is compatible with Sierra Wireless's EM7690 4G LTE-A Pro module to help facilitate the migration and differentiation between 4G LTE and 5G. This 5G NR Sub-6 GHz and mmWave embedded module is applicable to a wide range of IoT applications such as industrial routers, home gateways, industrial and consumer laptops, rugged tablet PCs, video surveillance and digital signage.

KEY FEATURES:

  • Up to 5.5Gbps downlink and 3Gbps uplink speeds
  • 3GPP Rel-15 compliant
  • Automatic 4G and 3G fallback networks
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
Chipset
Type System-on-Modules
EM9191
Offering global 5G connectivity, the EM9191 is designed in an M.2 form factor and is compatible with Sierra Wireless's EM9190 module for a simple upgrade path to mmWave, as well as the EM7690 module to help facilitate the migration and differentiation between 4G LTE and 5G. This 5G NR Sub-6 GHz embedded module is applicable to a wide range of IoT applications such as industrial routers, home gateways, industrial and consumer laptops, rugged tablet PCs, video surveillance and digital signage.

KEY FEATURES:

  • Up to 4.5Gbps downlink and 660Mbps uplink speeds
  • 3GPP Rel-15 compliant
  • Automatic 4G and 3G fallback networks
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou and Galileo satellite systems supported)
Chipset
Type System-on-Modules
GW3000 CPE
Based on Qualcomm® Snapdragon™ X55 platform, this system on module runs Android and Linux, and is targeted for global telecom operators to support connectivity and networking devices and services.
Chipset
Type System-on-Modules
SD6500 4G OBD SoM
Based on Qualcomm® MDM9x07, this is an IOT connectivity system on module. Supports Linux.
Chipset
MDM9x07C
Type System-on-Modules
GW500 CPE
Based on Qualcomm® MDM9x07 modem, this system on module is targeted for Connectivity and Networking. It supports Android and Linux.
Chipset
MDM9x07C
Type System-on-Modules
ZM5330 4G Module
Based on Qualcomm® MDM9x07 modem, this 4G module runs Linux and is targeted for Automotive industry.
Chipset
MDM9x07C
Type System-on-Modules
GM800 5G module
Based on Qualcomm® Snapdragon™ X55 modem system, the GM800 module supports 5G NR and Sub-6 GHz and mmWave. It falls back to 4G and is made in the M.2 standard form factor. Recommended for telematics, VR, Security and monitoring industries, and more.
Chipset
Type System-on-Modules
4G Tracker for Personnel
This System on Modules is based on Qualcomm® MDM9x07 platform and is targeted as a 4G personnel tracker. Supports Linux.
Chipset
MDM9x07C
Type System-on-Modules
WNC's C-V2X Module
WNC's C-V2X module based on the Qualcomm® 9150 C-V2X ASIC has a compact LGA form factor aimed at automotive applications such as for OBU and TCU. The mPCIe card is equipped with standard mPCIe compliant pin-outs perfect for RSU products and provides a significant upgrade from previous designs.

KEY FEATURES:

  • Supports low latency direct communications (PC5)
  • Security and privacy on V2V/V2I/V2P as per IEEE WAVE and ETSI ITS security services
  • MCP Memory: LPDDR2 (2 Gb) with NAND (4 Gb)
  • USB 3.0
  • Supports GNSS
Chipset
Type System-on-Modules
LE910Cx Linux mPCIe Series
The LE910Cx series Mini PCIe (mPCIe) modules are optimized for LTE low category networks and are available in single mode and 3G/2G fallback options. In addition to VoLTE support, the LE910Cx series are swappable with other modules in the xE910 mPCIe family.

KEY FEATURES:

  • Best-in class 3GPP Rel 10 platform
  • Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
  • Battery-friendly 1.8V GPIO
Chipset
Type System-on-Modules
LE910Cx ThreadX mPCIe Series
The LE910Cx series Mini PCIe (mPCIe) modules are optimized for LTE low category networks and are available in single mode and 3G/2G fallback options. In addition to VoLTE support, the LE910Cx series are swappable with other modules in the xE910 mPCIe family.

KEY FEATURES:

  • Best-in class 3GPP Rel 10 platform
  • Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
  • Battery-friendly 1.8V GPIO
Chipset
Type System-on-Modules
PLS63
The PLS63-W offers a global approach to cost-optimized IoT connectivity, with 18 Band LTE Cat.1, Eight Band 3G HSPA/UMTS, and Quad-Band GSM for seamless coverage across multiple wireless networks. Alternatively, where a global solution is not required, a variety of regional variants with the latest network banding deliver targeted connectivity for North America, Europe and APAC, Latin America and Japan.

KEY FEATURES:

  • LTE Cat 1, Global and multiple Regional variants with latest network bonds grouping
  • 3G and 2G fallback
Chipset
Type System-on-Modules
PLS83
The PLS83-W IoT Module provides global high-speed IoT connectivity with 2G/3G fallback, with 18 Band LTE Cat.4, Eight Band 3G UMTS/WCDMA, and Quad-Band GSM for seamless coverage when roaming across different wireless networks. When a global solution is not needed, a variety of regional variants with the latest network band groupings deliver targeted connectivity for North America, Europe, Asia-Pacific, Latin America and Japan

KEY FEATURES:

  • LTE Cat 4, Global and multiple Regional variants with latest network bands grouping
  • 3G and 2G fallback
Chipset
Type System-on-Modules
LTE AG35 Automotive Module series
AG35 is a series of automotive grade LTE category 4 modules developed by Quectel. Designed and manufactured according to IATF 16949:2016 quality management system, it is targeted at the IoV (Internet of Vehicles) applications. Adopting the 3GPP Rel-10 LTE technology, it features maximally 150 Mbps downlink and 50 Mbps uplink data rates. It provides abundant interfaces for customers to develop applications, and its excellent performance in ESD and EMI protection ensures great robustness in harsh environments.

KEY FEATURES:

  • Applications, such as fleet management, vehicle tracking, in-vehicle navigation system, vehicle remote monitoring, vehicle remote control, remote vehicle diagnostics, vehicle wireless routing, in-car entertainment. 
Chipset
MDM9628
Type System-on-Modules
Wi-Fi & Bluetooth FC64E
FC64E is a high-performance Wi-Fi 6 and BLE (Bluetooth 5.2) module in LCC package. It can be used to establish WLAN and Bluetooth connections. Supporting 2×2 + 2×2 MIMO, it provides a maximum data rate up to 1774.5Mbps. With a compact and unified form factor of 19.9mm × 18.0mm × 2.1mm, FC64E is an ideal Wi-Fi/Bluetooth solution for size-sensitive applications, and helps customers reduce product size and optimize application design cost. The surface-mount technology enhances its durability and robustness, and the LCC package ensures that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. 

KEY FEATURES:

  • Its compact size and extended temperature range, enables the module to meet Wi-Fi/Bluetooth application design requirements in industrial, consumer and automotive fields
Chipset
QCA2064
Type System-on-Modules
Wi-Fi & Bluetooth FC66E
FC66E is a high-performance Wi-Fi 6E and BLE (Bluetooth 5.2) module in LCC package. It can be used to establish WLAN and Bluetooth connections. Supporting 2x2 + 2x2 MIMO, it provides a maximum data rate up to 3000Mbps. With a compact and unified form factor of 19.9mm × 18.0mm × 2.1mm, FC66E is an ideal Wi-Fi/Bluetooth solution for size-sensitive applications, and helps customers reduce product size and optimize application design cost. The surface-mount technology enhances its durability and robustness, and the LCC package ensures that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package allows for large-scale automated 

KEY FEATURES:

  • Its compact size and extended temperature range, enables the module to meet Wi-Fi/Bluetooth application design requirements in industrial, consumer and automotive fields.
Chipset
Type System-on-Modules
LTE-A module EP06
Quectel EP06 is a series of LTE category 6 module optimized specially for M2M and IoT applications. Adopting the 3GPP Rel-11 LTE technology, it delivers maximum data rates up to 300Mbps downlink and 50Mbps uplink. Designed in the Mini PCIe form factor, EP06 series contains 2 variants (EP06-E and EP06-A) for different target regions and both variants nearly cover all the main stream carriers worldwide.

KEY FEATURES:

  • Supports LTE-A CA
  • Worldwide 4G and 3G coverage
Chipset
MDM9240
Type System-on-Modules
EC25
Based on the Qualcomm® 9207 LTE Modem, Quectel EC25 is a series of LTE Cat 4 module optimized specially for M2M and IoT applications. Adopting the 3GPP Rel. 11 LTE technology, it delivers maximum data rates up to 150Mbps downlink and 50Mbps uplink. Designed in the compact and unified form factor, EC25 is compatible with Quectel multi-mode LTE Standard EC21/EC20 R2.0/EC20 R2.1/EG25-G/EG21-G modules and UMTS/HSPA+ UC20/UC200T module, which allows for flexible migration among them.
Chipset
Type System-on-Modules
LTE EG91 series
Based on Qualcomm® MDM9x07, Quectel EG91 is a series of LTE category 1 modules optimized specially for M2M and IoT applications. Adopting 3GPP Rel. 11 LTE technology, it delivers maximum data rates up to 10Mbps downlink and 5Mbps uplink. These make EG91 an ideal solution for numerous IoT applications that are not reliant on high speed connectivity but require the longevity and reliability of LTE network.

KEY FEATURES:

  • Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
  • Cost-effective and low-power LTE connectivity optimized for broadband
  • Multi-band LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
Chipset
Type System-on-Modules
EC21 Mini PCIe
Based on Qualcomm® 9207 LTE Modem, this 4G CAT4 data module supports Linux, Windows, Android. Quectel EC21 Mini PCIe is a series of LTE category 1 module adopting standard PCI Express® Mini Card form factor (Mini PCIe). Specially optimized for M2M and IoT applications, it features cost-effective, low-power LTE connectivity, and delivers M2M-optimized speeds of 10Mbps downlink and 5Mbps uplink. These make it ideal for numerous IoT applications that are not reliant on high speed connectivity.
Chipset
Type System-on-Modules
LTE EC25 Mini PCIe series
This 4G CAT4 data module is based on the Qualcomm® 9207 LTE Modem. It supports Linux, Windows, Android . Quectel EC25 Mini PCIe is a series of LTE category 4 module adopting standard PCI Express® Mini Card form factor (Mini PCIe). It is optimized specially for M2M and IoT applications, and delivers 150Mbps downlink and 50Mbps uplink data rates.
Chipset
Type System-on-Modules
LTE EC21 Module series
Based on Qualcomm ® MDM9x07, this 4G CAT4 data module supports Linux, Windows, Android. Quectel EC21 is a series of LTE category 1 module optimized specially for M2M and IoT applications. It features cost-effective, low-power LTE connectivity, and delivers maximum data rates up to 10Mbps downlink and 5Mbps uplink. These make EC21 an ideal solution for numerous IoT applications that are not reliant on high speed connectivity but still require the longevity and reliability of LTE networks.
Chipset
Type System-on-Modules
LTE EG95 series
Based on Qualcomm® MDM9x07, Quectel EG95 is a series of LTE category 4 module optimized specially for M2M and IoT applications. Adopting 3GPP Rel. 11 LTE technology, it delivers maximum data rates up to 150Mbps downlink and 50Mbps uplink. These make EG95 an ideal solution for numerous IoT applications that are not reliant on high speed connectivity but still require the longevity and reliability of LTE network.
Chipset
Type System-on-Modules
AG15 Automotive grade module
Based on the Qualcomm® 9150 C-V2X ASIC, Quectel's AG15 is an automotive grade C-V2X module designed and manufactured according to IATF 16949:2016 standards. It is designed for use in extremely harsh environments and provides superior ESD/EMI protection performance. Through C-V2X PC5 direct communications, AG15 can make traffic smoother and more efficient through paving the way for automated driving and achieving the goal of fully connected traffic.
Chipset
Type System-on-Modules