4 results

Filter by:

BTM395 Module
The BTM395 Bluetooth module features the Qualcomm® QCC3095 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker, headsets, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

KEY FEATURES:

  • Bluetooth 5.4 & Qualcomm® QCC3095 chip
  • Multi - codec (aptX, aptX HD, aptx-adaptive) support
  • 240 MHz audio DSP integration
Dual Mode (LC3 Auracast, Unicast and Classic BR/EDR) Audio and Data Module
IDC777 is a fully integrated Dual Mode LE Audio and Classic Audio Bluetooth module. IDC777 offers both LE Audio (LC3 Codec Auracast and Unicast) and Bluetooth Classic (aptX, aptX-HD, apt-X Lossless, Snapdragon Sound). IDC777 offers best in class performance in every single aspect of Bluetooth. IDC777 is based on the latest generation Bluetooth 6.0 Qualcomm Audio chip. IDC777 is easy to supply and offers a long life. DC777 offers a high level UART command interface (AudioAgent) that provides full control of all profiles such as UniCast and Auracast for LE Audio (LC3 Codec) and HFP, HSP or HFP-AG (HandsFree Voice), A2DP Source and Sink and AVRCP (Music Streaming), PBAP (Phone Book Access Profile) and MAP (Message Access Profile) for Classic. IDC777 connects to Android and iOS Apps using Bluetooth Low Energy, the Serial Protocol Profile (SPP) or HID (Over Classic, USB or BLE GATT). The module can act as receiver of Audio but also as a Transmitter. IDC777 can be a Central or Peripheral BLE device. In Peripheral mode, it the users can create their own BLE profiles.

KEY FEATURES:

  • Concurrent LE Audio and Classic 6.0 Bluetooth Module
  • Standalone or Simple UART/USB commands. Classic Audio & Data Rx/Tx
  • HFP, HFP-AG, A2DP Sink, A2DP Source, SPP, BLE Central/Peripheral
  • PBAP, MAP, HID (USB, Bluetooth, BLE)
  • LE (LC3) Auracast (Broadcast) and Unicast Receive and Transmit
  • Analog (120dB SNR) and Digital Interface (-100dB SNR)
  • Snapdragon Sound: aptX (-HD), aptX-Lossless, LC3, SBC, AAC
  • Ultra Low Latency: Down to 20ms Latency (Gaming Mode)
  • I2S, PCM, UART, I2C, SPDIF, USB, IOs Interfaces
  • Firmware Upgrade via UART, USB or Bluetooth (Over the Air)
  • Bluetooth, FCC, RED, IC, MIC, KCC, SRRC Certified
  • Comes with variants for external Antenna or Long Range
Chipset
Type System-on-Modules
IDC777-DISKIT
IDC777 is the evaluation and development board for the IDC777 module. This board contains the IDC777 (LE Audio (Auracast and Unicast), Classic Bluetooth (A2DP Source and Sink, HFP, AGHFP, PBAP, HID and MAP) and BLE Data. So it is also used as a simple test board when you are testing your LE Audio or Classic Bluetooth Products.

KEY FEATURES:

  • Development Board for the IDC777
  • Dual Mode LE Audio (Auracast/Unicast) and BR/EDR
Chipset
Type Development Kits
SonicBoom by Virscient
Launching a new audio product? Our hardware reference designs make it easy. Whether it’s earbuds, headsets, glasses, or speakers, we deliver complete, application-specific platforms packed with everything you need—microphones, amps, sensors, chargers, even a charging case. Designed for quick and easy customization, our schematics and layouts are clean, functional, and structured for speed. And yes, we provide polished Altium master design files, so you’re not starting from scratch. Just plug in your vision—we’ll help bring it to life.

KEY FEATURES:

  • Application specific reference designs
  • Easily customizable