Cardinal Peak delivers complete product engineering for next-generation wireless audio systems. We assist innovative brands and startups in integrating Qualcomm Technologies’ full Bluetooth® audio portfolio—from system bring-up and custom DSP algorithm development to manufacturing partner handoff.

We provide hardware design and production services, covering schematics, prototyping, final production—including certification via manufacturing partners. With China's highly efficient manufacturing capabilities, we ensure streamlined production processes. We also offer sub-board and custom module design. Our experienced team, focused solely on Qualcomm Technologies chips, delivers fast, cost-effective solutions to any specs, with a focus on optimizing range, minimizing leakage, and eliminating audio interference.

Firmware development services for wireless audio segments, covering classic Bluetooth and LE audio, with support for Bluetooth headsets, speakers, audio transmitters, receivers, intercoms and active noise cancellation headsets. Our design capabilities span all levels, including drivers, application frameworks, customized profiles, user case design, audio flow design, full applications and UI, as well as 3rd party IP porting and integration.We analyze customer requirements, work out software architecture and block diagrams, and formulate project resources and schedule plans.The firmware we deliver targets production quality, not just prototyping.

Cardinal Peak collaborates with its clients to brainstorm, develop, launch, and support best-in-class products. Our deep engineering expertise in multiple disciplines—together with our unparalleled performance—make us the trusted ally of innovative firms around the world. We work with leading companies, large and small, in multiple industries to develop the products that change lives. We support our clients with Product Ideation, Embedded Development, Cloud and Mobile Application development. We have developed numerous consumer and automotive audio products as well as many of IoT devices. Additionally, we have deep skills in adding voice to your product.

RelaJet provides integrated SW and HW solution for OTC hearing aid and hearing amplifier for form factors such as earbuds, OWS, CIC, and RIC based on Qualcomm® QCC518x and Qualcomm® QCC309x.