DCM8633
Not Recommended For New Designs
DCM8633
Contact sales
DCM8633

Audio platform for wired and wireless applications like speakerphone, stereo, and mono speakers.

The DCM8633 QFN is a single-chip Bluetooth read only memory (ROM) audio solution for rapid evaluation and development of Bluetooth ROM stereo applications. The DCM8633 QFN consumer audio platform for wired and wireless applications using the quad-flat no-lead (QFN) package integrates an ultra-low power digital signal processor (DSP) and application processor with embedded flash memory, a high-performance stereo codec, a power management subsystem and light-emitting diode (LED) drivers.

The enhanced Kalimba DSP coprocessor with 80 MIPS...

DCM8633 is a product of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Features

  • Bluetooth v5.0 specification specification compliant
  • 80 MHz RISC MCU and 80 MIPS Qualcomm® Kalimba™ DSP
  • Stereo codec with 1 microphone input (shared with line input) and 1 digital microphone (MEMS) interface
  • Internal ROM, serial flash memory and EEPROM interfaces
  • Secure simple pairing, Qualcomm Technologies International, Ltd. (QTIL)'s proximity pairing and QTIL's proximity connections
  • Stereo line-in
  • Serial interfaces: USB 2.0, UART, I²C and SPI
  • Wired audio support
  • Integrated dual switch-mode regulators, linear regulators and battery charger
  • Radio includes integrated balun with RF performance of 8 dBm transmit power and -89 dBm receiver sensitivity
  • AVRCP v1.4 
  • Wideband speech supported by HFP v1.6 and mSBC codec
  • Echo cancellation and wind noise reduction
  • Multipoint support for A2DP connection to 2 A2DP sources for music playback
Specifications
DSP
Name
Qualcomm® Kalimba™
Bluetooth
Specification Version
Bluetooth® 5.0
Interfaces
Supported Interfaces
UART, I²C, USB 2.0, SPI
Universal Serial Bus (USB)
Specification Version
USB 2.0
Package
Size
8 × 8 × 0.9 mm
Pitch
0.4 mm

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DCM8633
Not for new design

Bluetooth® 5.0

UART
I²C
USB 2.0
SPI

USB 2.0

0.4 mm

8 × 8 × 0.9 mm

Qualcomm® Kalimba™

Processors

NOT FOR NEW DESIGNS

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