Bluetooth® audio ROM platform with Qualcomm® cVc™ noise cancellation technology for entry level to mid-range audio devices.

The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level ...

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The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level ...

more

The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level to mid-range wireless audio products with support for voice and music. The CSR8640 is part of the CSR86xx portfolio, a range of silicon platforms for wireless audio applications wh...

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The CSR8640 dual-mode ROM audio SoC offers various capabilities found in the CSR8670 SoC, including cVc noise cancellation technology in a ROM-based package, ideal for entry-level to mid-range wireless audio products with support for voice and music. The CSR8640 is part of the CSR86xx portfolio, a range of silicon platforms for wireless audio applications which integrate a dual-mode Bluetooth radio, a low power DSP, an application processor, a battery charger, memory and various audio and hardware interfaces into a single-chip solutio...

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CSR8640, Qualcomm cVc and Qualcomm Kalimba are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

Product license agreement

Ideal for entry-level to mid-range wireless audio products

The CSR8640 SoC has a reduced feature set supporting the essential features expected from Bluetooth audio products while providing cost efficiency for entry-level products.

Integrated single-chip solution for smaller designs

Application processor, Bluetooth and Bluetooth low energy radios, DSP and memory integrated into a single SoC helps reduce system complexity and eBOM while supporting small form factor designs.

No software development required

Pre-loaded Bluetooth and audio applications allow manufacturers to develop end-products without writing code, while customization tools support quick modification of device behaviour and user interface.

cVc 6th generation 2-mic audio technology

cVc technology is a suite of algorithms designed to work on the transmit and receive path of voice calls to deliver optimum voice quality on Bluetooth headsets, handsets, hands-free devices, and automotive.

CSR8640 Block Diagram

Features

  • Bluetooth 4.0 specification compliant
  • Flexible ROM-based platform with fully configurable MMI and tool chain
  • Support for various profiles including: HFP 1.6, A2DP 1.2 AVRCP 1.4
  • 80MHz Qualcomm® Kalimba™ DSP with integrated multipoint A2DP and HFP audio applications
  • 2-mic cVc 6th Generation voice processing technology with wideband speech
  • Audio tuning suite with audio enhancements and 5-band EQs
  • Internal ROM, serial flash memory and EEPOM interfaces
  • MP3, AAC and SBC audio codecs
  • GAIA V1 and associated Android and iOS apps for connectivity with mobile devices
  • Reference speaker and headset applications pre-loaded on the ROM
  • Fast charging support up to 200mA with no external components
  • Pin compatible with CSR8645
Specifications
CPU
Clock Speed
Up to 80 MHz
DSP
Name
Qualcomm® Kalimba™
Bluetooth
Specification Version
Bluetooth® 4.1
Links
Dual eSCO, Dual A2DP
Classic Profiles
Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.2, Bluetooth® Hands-Free Profile (HFP) 1.6, Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.4, Bluetooth® Headset Profile (HSP) 1.2, Bluetooth® Device ID Profile (DIP) 1.3
Maximum Output Power (typical)
Up to 9 dBm
Receiver Sensitivity (Basic Rate, typical)
Down to -92 dBm
Audio
Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support
Qualcomm® cVc™ Echo Cancelling and Noise Suppression
Other Audio Capturing Technologies
HD Voice, Talk-Time Extension
Other Audio Processing Technologies
5-band EQ
Charging
Maximum Current
200 mA1, 500 mA2
  1. On chip
  2. With external transistor

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