Bluetooth® Solutions
Combining Bluetooth with Cellular Radios, FM, Codec and Touch Screen Controller
Qualcomm offers proven, world class Bluetooth® Hardware and Software solutions for mobile phones and other portable devices requiring low power consumption and a small form factor. The Bluetooth System on Chip (SoC) and integrated solutions support both Bluetooth 2.X + EDR (Enhanced Data Rate) and Bluetooth 3.0 + H.S. (High Speed), which is the latest version of the Bluetooth Specification. The SoC’s are available in several package options which allow for direct PCB attachment or for use in modules that include the Band -Pass Filter and other required external components. The integrated solutions combine Bluetooth with cellular radios, FM, Codec and touch screen controller and offer the smallest form factor available for handset platforms. Along with these SoC’s and integrated solutions, Qualcomm provides the complete Bluetooth Upper Layer Software Stack and Profiles.
Qualcomm's Bluetooth solutions facilitate wireless transfers of audio and data between Bluetooth enabled handsets, headsets, car-kits and other electronic devices.
The Possibilities are Unlimited
Complementary to other wireless technologies found on Qualcomm solutions, Bluetooth enables portable devices to connect and synchronize anywhere in the world. The possibilities for new products and services leveraging Qualcomm's Bluetooth solutions are unlimited.
Qualcomm Bluetooth solutions offer:
- Cost-effective implementation of Bluetooth capabilities for handset and other portable device manufactures.
- Enable slimmer form factors by reducing space requirements due to a small footprint and low external component count.
- Minimal impact on battery life due to low active, standby and sleep power consumption requirements.
- Turn-key solutions that have been fully integrated, tested and verified on Qualcomm platforms.
- Bluetooth Special Interest Group Qualifications that manufacturer's can leverage thereby reducing their own Qualification testing requirements.
- Fully verified reference designs that reduce OEM development time, engineering resource requirements and time to market risk.
Key Functionality
Qualcomm Bluetooth solutions provide:
- Bluetooth 2.X + EDR and BT 3.0 + High Speed compliance
- High speed UART (4 Mbps) interface to host for control and data
- Support for all ACL, SCO and eSCO packet types
- Piconet and Scatternet support
- 802.11 Coexistence via Packet Traffic Arbitration (PTA)
- Direct conversion radio architecture reduces out of band emissions
- Receiver sensitivity down to -91 dBm
- Transmitter output up to +12dBm
- Integrated regulators
- Ball Grid Array, Bumped Die, Wafer Scale Package and integrated options
Bluetooth System on Chip Solutions
| Product | Size | Bluetooth Specification |
|---|---|---|
| BTS 4020 | 4.5 x 4.5 - BGA | Bluetooth 2.0 + EDR |
| BTS 4020BD | 3.2 x 3.2 - Bumped Die | Bluetooth 2.1 + EDR |
| BTS 4021 | 4.5 x 4.5 - BGA | Bluetooth 2.1+ EDR |
| BTS 4025 | 3.2 x 2.9 - WSP | Bluetooth 2.1 + EDR |
| QTR 8x00 | Integrated Bluetooth | Bluetooth 3.0 + High Speed |
| QSC 6xx5 | Integrated Bluetooth | Bluetooth 3.0 + High Speed |
Bluetooth Profiles
| Bluetooth Profile | Version |
| A2DP | 1.0 |
| AVRCP | 1.0/1.3 |
| BIP | 1.0 |
| BPP | 1.0/1.2 |
| DUN | 1.1 |
| FTP | 1.1 |
| GAVDP | 1.0 |
| GOEP | 1.1 |
| HFP | 1.5 |
| HSP | 1.1 |
| HID | 1.0 |
| OPP | 1.1 |
| PBAP | 1.0 |
| SAP | 1.0 |
| SDAP | 1.1 |
| SPP | 1.1 |
