Effective October 1, 2012, QUALCOMM Incorporated completed a corporate reorganization in which the assets of certain of its businesses and groups, as well as the stock of certain of its direct and indirect subsidiaries, were contributed to Qualcomm Technologies, Inc. (QTI), a wholly-owned subsidiary of QUALCOMM Incorporated. Learn more about these changes

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Mike Concannon

Sr. Vice President, Product Management

Michael Concannon serves as Senior Vice President of Connectivity and Wireless Modules at Qualcomm CDMA Technologies (QCT). In this role, he is responsible for managing connectivity solutions for the company’s chipset platform. He also oversees the development of new business in adjacent markets for the division in the area of wireless modules, including such products as Gobi.
Concannon brought nearly thirty years of experience in the semiconductor industry to Qualcomm. He began his career at IBM Corporation, Microelectronics division in 1979 as a design engineer working on advanced RISC processors, single chip Token Ring and High Speed SRAMS. While at IBM his responsibility grew in design and operations while managing the DRAM memory and foundry business units. In 1995 he was named Vice President for Business Process re-engineering for the Microelectronics division. In 2000 he was named Vice President of the High-Performance Foundry business unit which included leading-edge CMOS, SOI and SiGe technologies.
Concannon holds a BSEE from Polytechnic University of New York. He also holds several patents, in circuit design and semiconductor process and has several publications to his name. He was the recipient of the IBM Patent Achievement Award in 1991. Concannon has lectured internationally in the area of semiconductors and ICs, and has been the keynote speaker at several conferences addressing technology and re-engineering.