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Qualcomm Announces Highly Integrated Receiver to Support Global 3G WCDMA (UMTS) Roaming and Simultaneous A-GPS

– November 06, 2003 – SAN DIEGO -- November 6, 2003 -- Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced the highly integrated radioOne™ Zero Intermediate Frequency (ZIF) RFR6250™ device, a complete dual-band WCDMA (UMTS) and Global Positioning System (GPS) receive chip. Supporting WCDMA (UMTS) at 1900 MHz and 2100 MHz, as well as simultaneous assisted GPS capabilities, the RFR6250 combines three radio frequency (RF) chips into one, delivering one of the industry's most integrated and cost-effective RF solutions to support global roaming and location based services for WCDMA (UMTS) networks. Samples of the RFR6250 chipset are expected to ship to customers in the second quarter of 2004.

"Qualcomm continues to address WCDMA (UMTS) market needs with this highly integrated RF device. With the RFR6250 solution, we've integrated three chips into a single chip, resulting in reduced circuit-board space and parts count to provide manufacturers with an efficient, cost-effective RF solution," said Dr. Sanjay Jha, president of Qualcomm CDMA Technologies. "As the RF companion to Qualcomm's MSM6250 and MSM6275 baseband chipsets and system software, the RFR6250 device enables worldwide WCDMA (UMTS) roaming combined with advanced GPS position-location applications and services."

The RFR6250 chip integrates the following - formerly separate - chips to create an advanced solution that reduces component count while maintaining a high level of performance:

  • Qualcomm's RFL6200™ low-noise amplifier (LNA)
  • Qualcomm's RFR6200™ receiver
  • Qualcomm's RGR6200™ GPS radio receiver

In addition, the RFR6250 solution also integrates the External UHF Voltage Controlled Oscillator (VCO).

The RFR6250 chip operates in conjunction with Qualcomm's MSM6250™ and MSM6275™ Mobile Station Modem™ (MSM™) chipset and system software solutions. The MSM6250 chipset is Qualcomm's third WCDMA (UMTS) chipset, a single-chip solution that includes all the advanced multimedia capabilities of the Launchpad™ suite of applications on Qualcomm's proven modem platform. The MSM6275 chipset supports High Speed Downlink Packet Access (HSDPA) - a next-generation WCDMA (UMTS) technology.

The RFR6250 chip is based on Qualcomm's radioOne Zero Intermediate Frequency (ZIF) architecture, which eliminates the need for Intermediate Frequency (IF) components. Qualcomm's radioOne technology requires less printed-circuit-board area than previous generations and reduces time-to-market development and bill-of-material (BOM) costs.

The RFR6250 chip is fabricated with a silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) process, which enables high linearity and low power consumption, and is available in a 7x7 mm 48-pin Quad Flat No-Lead (QFN) package.

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and is a 2003 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 2003, and most recent Form 10-Q.

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