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Qualcomm CDMA Technologies Takes Delivery of MSM6050 Chip, First Wireless Baseband IC from TSMC's 300mm Wafer Fab Line

– November 08, 2001 – SAN DIEGO -- November 8, 2001 -- Qualcomm Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced it received the first test samples of the Company's third-generation (3G) MSM6050™ Mobile Station Modem (MSM™) device. The MSM6050 device is the first wireless baseband chip produced using state-of-the-art 300mm (12-inch) complementary metal-oxide semiconductor (CMOS) fabrication from Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) (NYSE: TSM).

"Qualcomm is proud to be the first wireless semiconductor company in the world to produce a baseband IC on 300mm wafers," said Don Schrock, president of Qualcomm CDMA Technologies. "The MSM6050 chipset demonstrates how teams from QCT and TSMC have optimized engineering and business models to meet market demands for efficiency in design methodology, flexibility, and security of supply for solutions that are cost-effective and enable fast time-to-market product development for our customers."

"TSMC's foundry manufacturing expertise and leadership is clearly demonstrated with this partnership with Qualcomm CDMA Technologies," said Kenneth Kin, senior vice president of sales and marketing at TSMC. "Rolling out the MSM6050 chip on both our 200mm (8-inch) and 300mm foundry lines demonstrates that TSMC is prepared to support QCT's customers with cost-effective, flexible and high-volume product for their 3G terminal developments. We look forward to providing the same high level of service on future QCT chipsets."

The milestone represented by these first samples of the MSM6050 device produced on 300mm wafers by TSMC illustrates how QCT's fabless business model brings together industry-leading partners to meet demanding market needs in the highly competitive mobile marketplace, where time-to-volume and the most cost-effective solutions are needed to produce successful 3G solutions.

The MSM6050 chipset and system software is QCT's highly integrated next-generation CDMA2000 1X product, which will offer increased processing power in a mid-tier 3G solution that doubles system voice capacity over previous IS-95A/B solutions, supports data rates of up to 153 kilobits per second (kbps), and integrates QCT's radioOne™ Zero Intermediate Frequency (ZIF), or a direct conversion, architecture.

The MSM6050 solution also offers gpsOne™ position location capabilities and the advanced feature set of QCT's Wireless Internet Launchpad™ suite of technologies, offering a rich mixture of multimedia, connectivity, position location, user interface and storage capabilities. In addition, the MSM6050 chip supports Qualcomm's Binary Runtime Environment for Wireless™ (BREW™) applications platform.

With the rapid growth of CDMA and the acceleration of deployment of 3G CDMA2000 1X networks, demand for next-generation MSM6050 chipsets is expected to grow significantly. Use of 300mm fabrication lines, with the latest fabrication processing equipment, provides more than twice the number of parts per wafer compared to traditional 200mm fabrications, meaning that fewer wafer starts are needed to support increasing volumes of product.

Internal engineering evaluations of the samples are ongoing, and teams at QCT and TSMC expect to provide customer samples of the MSM6050 chipset and system software in the first quarter of calendar 2002.

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading-edge foundry services. TSMC operates two 150mm (6-inch) wafer fabs and six 200mm wafer fabs. The company also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC) and WaferTech. In 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.

QCT (www.cdmatech.com), a division of Qualcomm Incorporated, is a developer and supplier of CDMA chipsets, hardware and software solutions, and tools, with 175 million cumulative shipments of MSM chips worldwide. QCT offers wireless position location technology by SnapTrack™, a wholly owned subsidiary of Qualcomm. QCT supplies chipsets to the world's leading CDMA handset and infrastructure manufacturers including: Acer Peripherals, Inc.; ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and Toshiba Corporation, among others.

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's business areas include CDMA chipsets and system software; technology licensing; the BREW applications platform; Eudora® e-mail software; digital cinema systems; and satellite-based systems including portions of the Globalstar™ system and wireless fleet management systems, OmniTRACS® and OmniExpress®. Qualcomm owns patents that are essential to all of the CDMA wireless telecommunications standards that have been adopted or proposed for adoption by standards-setting bodies worldwide. Qualcomm has licensed its essential CDMA patent portfolio to more than 100 telecommunications equipment manufacturers worldwide. Headquartered in San Diego, Calif., Qualcomm is included in theS&P500 Index and is a 2001 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2001 and most recent Form 10-Q.

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