Demos at MWC:
HSPA+ Evolution: Coverage & uplink capacity improvements through uplink Tx diversity (closed loop beam-forming), a feature considered for HSPA+ evolution. Strong evolution path expanding HSPA+ to 20 MHz deployments with up to 168 Mbps peak data rates. More information: www.qualcomm.com/hspa_plus
LTE Advanced: Mobility enhancements and seamless handoff using Qualcomm’s LTE Advanced test bed; LTE Advanced will realize full benefits of networks with mix of macro and small power nodes, e.g. picocells and Femtocells. More information: www.qualcomm.com/lte
3G Femtocells: Advanced interference management techniques enabling femtocell deployments. Videos illustrating benefits of self calibration, range tuning, uplink adaptive attenuation, and femtocell discovery.
1X Advanced & DO Advanced: The strong evolution paths of CDMA2000 1X and EV-DO that quadruple voice capacity and maximize performance of EV-DO respectively. More information: www.qualcomm.com/1x_advanced; www.qualcomm.com/do_advanced
Sponsored Connectivity: A new business model to accelerate embedded 3G in computing and CE devices; offering convenient 3G access to content without traditional data plan.
3G/WiFi Seamless Offload: Seamless offloading of best-effort data from 3G to WiFi, illustrated through un-interrupted transition of web browsing/file download applications from 3G to WiFi, while still maintaining audio/video streaming on 3G.
Wearable Mobile Devices: A variety of wireless devices based on Qualcomm’s low cost, low power and compact wireless 3G data module, realizing the vision of “internet of things.” (showcased on GSMA booth/Embedded Mobile Zone). More information: http://www.qualcomm.com/products_services/consumer_electronics/wearable_mobile_device/index.html