Effective October 1, 2012, QUALCOMM Incorporated completed a corporate reorganization in which the assets of certain of its businesses and groups, as well as the stock of certain of its direct and indirect subsidiaries, were contributed to Qualcomm Technologies, Inc. (QTI), a wholly-owned subsidiary of QUALCOMM Incorporated. Learn more about these changes

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Qualcomm® RF360™ Front End Solution

Overview
Products

Truly Global. Integrated. Easily Customizable.

THE PROBLEM: 4G LTE band fragmentation
Multiple versions of the same LTE device are required to accommodate the worldwide proliferation of cellular bands—40 already and counting.

THE SOLUTION: Delivering one global design
The Qualcomm® RF360™ solution, a product of Qualcomm Technologies, Inc., enables OEMs to create a single multimode design for worldwide LTE mobility.

THE ADVANTAGE: Integration at the system level
OEMs can design thinner, battery friendly devices that deliver higher performance using less power, and that are capable of supporting all currently available modes and bands, worldwide.

Qualcomm RF360 Front End Solution, a comprehensive, system-level solution that addresses cellular radio frequency band fragmentation and enables a single, global 4G LTE design for mobile devices. The Qualcomm RF front end solution comprises a family of chips designed to address band fragmentation while improving RF performance and helping OEMs more easily develop multiband, multimode mobile devices supporting multiple 2G/3G/4G LTE standards.

Optimized system solution for worldmode LTE

RF Transceivers

Introducing Qualcomm WTR1625L. Our smallest, most integrated RF transceiver supporting unparalleled connectivity worldwide.

QFE15xx Antenna Matching Tuner

Antenna matching made easy
Industry’s first modem-assisted antenna matching tuner, which dynamically improves antenna performance in ultra-thin smartphones while operating over 2G/3G/4G LTE radio frequency bands, from 700-2700 MHz.

More bars. More coverage.
Dynamic antenna matching in the presence of physical impediments, engineered for consistent signal strength and improved talk time.

QFE11xx Envelope Power Tracker

Unprecedented efficiency
Industry’s first modem-assisted envelope power tracker for 3G/4G LTE mobile devices, reducing thermal footprint and RF power consumption by up to 30%, depending on the mode of operation, enabling thinner mobile devices with longer battery life.

QFE23xx Power Amp & Antenna Switch

Advantage integration
Industry’s first chip integrating a multiband CMOS power amplifier and antenna switch with support across 2G, 3G and 4G LTE cellular modes means significantly reduced PCB footprint, ease of routing and component count savings

QFE27xx RF POP™

Going vertical
Industry’s first, innovative 3D-RF packaging helps OEMs accelerate introduction of multimode devices with global LTE roaming while reducing development costs. Fabricated using a CMOS process, allowing greater integration of components in a single piece of silicon.