Intern Video: Kevin
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Kevin
Advanced Chipset Packaging, Intern
University of California, Berkeley
Major: Materials Science & Electrical Engineering
Kevin is our Advanced Chipset Packaging Intern. No, this does not involve bubble wrap and cardboard boxes. Qualcomm is the largest provider of 3G chipset and software technology in the world. So, Kevin's next-generation chipset packaging helps us continue to power the majority of all commercially available 3G devices. When he's not in the lab, you can find Kevin shooting hoops or skateboarding around campus.
